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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 学科主题：Engineering, Manufacturing     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Exit morphology and mechanical property of FDM printed PLA: influence of hot melt extrusion process 期刊论文 ADVANCES IN MANUFACTURING, 2022 作者:  Bian YH(边艳华);  Yu G(虞钢);  Zhao, Xin;  Li SX(李少霞);  He XL(何秀丽) 收藏  |  浏览/下载：17/0  |  提交时间：2022/10/23 Fused deposition modeling (FDM)  Polylactic acid (PLA)  Exit morphology  Tensile property  Printing process window   U-R relationship prediction method for aluminum alloy circular tube free-bending process based on sensitivity analysis of material parameters 期刊论文 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 卷号: 99, 期号: 2018-05-08, 页码: 1967-1977 作者:  Guo, XZ;  Xiong, H;  Xu, Y;  Abd El-Aty, A;  Ma, YN 收藏  |  浏览/下载：30/0  |  提交时间：2018/12/25 Free bending  Material parameters  U-R relationship  Sensitivity analysis  Power hardening aluminum alloy  Prediction method   Evaluation of numerical and experimental investigations on the hybrid sheet hydroforming process to produce a novel high-capacity engine oil pan 期刊论文 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 卷号: 97, 期号: 2018-09-12, 页码: 3625-3636 作者:  Chen, DY;  Xu, Y;  Zhang, SH;  Zhao, ZJ;  El-Aty, AA 收藏  |  浏览/下载：42/0  |  提交时间：2018/12/25 High-capacity engine oil pan  Hydromechanical deep drawing  Hydro-bulging  Hybrid sheet hydroforming  FEM   Simulation and experimental research of the free bending process of a spatial tube 期刊论文 JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2018, 卷号: 255, 页码: 137-149 作者:  Guo, XZ;  Ma, YN;  Chen, WL;  Xiong, H;  Xu, Y 收藏  |  浏览/下载：34/0  |  提交时间：2018/06/05 Forming Process  Springback Prediction  Model  Diameters  Profile   Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829 作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai 收藏  |  浏览/下载：74/0  |  提交时间：2018/05/31 Component Architectures  Semiconductor Device Packaging