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CORC

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Understanding Interlayer Coupling in TMD-hBN Heterostructure by Raman Spectroscopy 期刊论文
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2018, 卷号: 65, 期号: 10, 页码: 4059-4067
作者:  Ding, L;  Ukhtary, MS;  Chubarov, M;  Choudhury, TH;  Zhang, F
收藏  |  浏览/下载：27/0  |  提交时间：2018/12/25
A comparative study on electrical properties of dye-sensitized solar cell and silicon photodiode under colored light for optical sensor applications 期刊论文
SENSORS AND ACTUATORS A-PHYSICAL, 2018, 卷号: 275, 页码: 148, 153
作者:  Wang, Wei;  Yuan, Huihui;  Zhang, Yumei;  Xie, Junjie;  Xu, Di
收藏  |  浏览/下载：29/0  |  提交时间：2018/12/28
Large enhancement of upconversion luminescence in Er3+/In3+:Ba0.85Ca0.15TiO3 lead-free piezoelectric ceramics 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 11, 页码: 9007, 9015
作者:  Guo, Lei;  Yan, Jian-Min;  Zhang, Yuan-Yuan;  Xu, Zhi-Xue;  Xu, Meng
收藏  |  浏览/下载：33/0  |  提交时间：2018/12/28
Ferroferric-Oxide Nanoparticle Based Optical Modulator for 2 mu m Spectral Region 期刊论文
IEEE PHOTONICS TECHNOLOGY LETTERS, 2018, 卷号: 30, 期号: 9, 页码: 777, 780
作者:  Liu, Xinyang;  Yang, Kejian;  Zhao, Shengzhi;  Zhao, Jia;  Li, Tao
收藏  |  浏览/下载：46/0  |  提交时间：2018/12/28
Lifetime of solder joint and delamination in flip chip assemblies 期刊论文
2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, 页码: 174-186
Cheng, ZN
收藏  |  浏览/下载：28/0  |  提交时间：2012/03/24

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