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Packaging of High Power Density Double Quantum Well Semiconductor Laser Array using Double-side Cooling Technology 会议论文
proceedings of 11th on electronic packaging technology& high density packaging (icept-hdp), 上海, 2011-8-8
Wang Jingwei(王警卫); Zhang Pu (张普); Xiong Lingling(熊玲玲); Li Xiaoning (李小宁); Peng Chenhui(彭晨晖); Yuan Zhenbang (袁振邦); Guo Lu (郭璐); Liu Xingsheng (刘兴胜)
收藏  |  浏览/下载:23/0  |  提交时间:2011/12/27
Technology Trend and Challenges in High Power Semiconductor Laser Packaging 会议论文
59th electronic components and technology conference (ectc), san diego, california usa, 2009-05
Xingsheng Liu; Wei Zhao
收藏  |  浏览/下载:283/49  |  提交时间:2010/01/14
Modeling of Thermal Phenomena in a High Power Diode Laser Package 会议论文
10th on electronic packaging technology & high density packaging (icept-hdp), beijing, 2009-08
Ephraim Suhir; Jingwei Wang; Zhenbang Yuan; Xu Chen; Xingsheng Liu
收藏  |  浏览/下载:58/12  |  提交时间:2010/01/13
Study of the Mechanisms of Spectral Broadening in High Power Semiconductor Laser Arrays 会议论文
58th electronic components and technology conference (ectc), lake buena vista, florida, 2009-05
Xingsheng Liu; Jingwei Wang; and Peiyong Wei
收藏  |  浏览/下载:239/56  |  提交时间:2010/01/13
SOA-based polarity-preserving all-optical wavelength conversion at 80Gbit/s: Wide conversion range, well dynamic characteristics and polarization insensitive 期刊论文
microwave and optical technology letters, 2008, 卷号: 50, 期号: 9, 页码: 2392-2399
作者:  Yan, Shuangyi;  Zhang, Jian-Guo;  Zhao, Wei
收藏  |  浏览/下载:98/6  |  提交时间:2010/01/18


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