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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 学科主题：半导体器件     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 An accelerated test method of luminous flux depreciation for LED luminaires and lamps 期刊论文 reliability engineering and system safety, 2016, 卷号: 147, 页码: 84-92 C. Qian; X.J.Fan; J.J.Fan; C.A.Yuan; G.Q.Zhang 收藏  |  浏览/下载：15/0  |  提交时间：2017/03/16 PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers 期刊论文 ieee transactions on industrial electronics, 2016, 卷号: 63, 期号: 11, 页码: 6726-6735 Bo Sun; Xuejun Fan; Cheng Qian; Guoqi Zhang 收藏  |  浏览/下载：17/0  |  提交时间：2017/03/16 Optimal Design of Life Testing for White LEDs Using the Six Sigma DMAIC Approach High-Brightness 期刊论文 ieee transactions on device and materials reliability, 2015, 卷号: 12, 页码: 419-436 Jiajie Fan; Cheng Qian; Kam-Chuen Yung; Xuejun Fan; Guoqi Zhang; Michael Pecht 收藏  |  浏览/下载：19/0  |  提交时间：2016/04/15 Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes 期刊论文 microelectronics reliability, 2014, 卷号: 54, 期号: 11, 页码: 2448-2455 Ye, Huaiyu; Li, Bo; Tang, Hongyu; Zhao, Jia; Yuan, Cadmus; Zhang, Guoqi 收藏  |  浏览/下载：22/0  |  提交时间：2015/03/20 Thermal and mechanical effects of voids within flip chip soldering in LED packages 期刊论文 microelectronics reliability, 2014, 卷号: 54, 期号: 9-10, 页码: 2028-2033 Liu, Y; Leung, SYY; Zhao, J; Wong, CKY; Yuan, CA; Zhang, GQ; Sun, FL; Luo, LL 收藏  |  浏览/下载：18/0  |  提交时间：2015/03/25