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A novel tube-structure entrapped curing accelerator for prolonging the shelf-life of epoxy resin-based microelectronic packaging material 期刊论文
JOURNAL OF MATERIALS CHEMISTRY, 2002, 卷号: 12, 期号: 8, 页码: 2325-2330
作者:  Zhang, Y;  Cao, M;  Guo, GQ;  Sun, J;  Li, Z
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