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CORC

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Dynamic Crack Propagation along Elastic Interfaces in Double Cantilever Beams under High Loading Rates 期刊论文
JOURNAL OF AEROSPACE ENGINEERING, 2022, 卷号: 35, 期号: 4, 页码: 9
作者:  Chen, Tianyu;  Yuan, Bo;  Harvey, Christopher M.;  Zhang, Kun;  Wang, Simon
收藏  |  浏览/下载：48/0  |  提交时间：2022/07/18
General condition of unidirectional mode conversion in periodic waveguide 期刊论文
JOURNAL OF OPTICS, 2018, 卷号: 20, 期号: 12
作者:  Zhang, Lingxuan;  Wang, Guoxi;  Li, Siqi;  Ge, Zhiqiang;  Wang, Weiqiang
收藏  |  浏览/下载：30/0  |  提交时间：2018/12/06
Marching schemes for inverse scattering problems in waveguides with curved boundaries 期刊论文
JOURNAL OF COMPUTATIONAL AND APPLIED MATHEMATICS, 2018, 卷号: 328, 页码: 287-301
作者:  Li, Peng;  Liu, Keying;  Zhong, Weizhou
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/19
Marching schemes for Cauchy wave propagation problems in laterally varying waveguides 期刊论文
JOURNAL OF INVERSE AND ILL-POSED PROBLEMS, 2018, 卷号: 26, 页码: 259-276
作者:  Li, Peng;  Liu, Keying;  Zhong, Weizhou
收藏  |  浏览/下载：1/0  |  提交时间：2019/11/19
A theoretical investigation on the parametric instability excited by X-mode polarized electromagnetic wave at Tromso 期刊论文
JOURNAL OF GEOPHYSICAL RESEARCH-SPACE PHYSICS, 2016, 卷号: 121, 期号: 4
作者:  Wang, Xiang;  Cannon, Patrick;  Zhou, Chen;  Honary, Farideh;  Ni, Binbin
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05
Dynamic caustic analysis of a propagating mode-III crack in functionally graded material based on a higher-order transient crack tip expansion 期刊论文
2010, 2010
Yao, X. F.; Xu, W.; Yeh, H. Y.
收藏  |  浏览/下载：3/0  |  提交时间：2017/06/15
Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE) 会议论文
MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China
Ming A.; Liang J.; Lan W.; Dong W.; Yao J.; Wang W.; Le Z.; Chen W.; Wang L.
收藏  |  浏览/下载：22/0  |  提交时间：2013/03/25
We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges  Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment  thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in  sixteen V-grooves for optical fibers  and micropits for micro ball lenses  all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners  where different geometries meet. Through this assembling method  the fiber  micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.  

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