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西安光学精密机械研究... [8]
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会议论文 [5]
期刊论文 [3]
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2018 [1]
2017 [3]
2016 [3]
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semiconduc... [3]
computer a... [2]
lasers, ge... [2]
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Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays
期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:
Nie, Zhiqiang
;
Lu, Yao
;
Chen, Tianqi
;
Zhang, Pu
;
Wu, Dihai
收藏
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浏览/下载:74/0
  |  
提交时间:2018/05/31
Component Architectures
Semiconductor Device Packaging
Thermal characteristics of kW-level conduction-cooled semiconductor laser array
期刊论文
Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering, 2017, 卷号: 46, 期号: 10
作者:
Zhu, Qiwen
;
Zhang, Pu
;
Wu, Dihai
;
Nie, Zhiqiang
;
Xiong, Lingling
收藏
  |  
浏览/下载:59/0
  |  
提交时间:2017/12/30
Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology
会议论文
components and packaging for laser systems iii 2017, san francisco, ca, united states, 2017-01-31
作者:
Wang, Jingwei
;
Zhu, Pengfei
;
Liu, Hui
;
Liang, Xuejie
;
Wu, Dihai
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  |  
浏览/下载:77/0
  |  
提交时间:2017/06/08
Optimization of microchannel cooler of high power diode laser array package
会议论文
components and packaging for laser systems iii 2017, san francisco, ca, united states, 2017-01-31
作者:
Wu, Dihai
;
Zhang, Pu
;
Nie, Zhiqiang
;
Liang, Xuejie
;
Wang, Jingwei
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  |  
浏览/下载:14/0
  |  
提交时间:2017/06/08
A compact QCW conduction-cooled high power semiconductor laser array
会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:
Zhu, Qiwen
;
Zhang, Pu
;
Wang, Shuna
;
Wu, Dihai
;
Nie, Zhiqiang
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  |  
浏览/下载:25/0
  |  
提交时间:2016/11/22
Chip scale packages
Electronics packaging
Finite element method
High power lasers
High temperature applications
Temperature
Thermal behavior of microchannel cooled high power diode laser arrays
会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:
Wu, Dihai
;
Zhang, Pu
;
Nie, Zhiqiang
;
Xiong, Lingling
;
Song, Yunfei
收藏
  |  
浏览/下载:30/0
  |  
提交时间:2016/11/22
Computational fluid dynamics
Copper
Crosstalk
Diodes
Electronics packaging
Finite element method
Flow of water
Heat resistance
Heat sinks
Hydraulics
Laser beam welding
Microchannels
Numerical methods
Optical properties
Power semiconductor diodes
Reliability
Thermodynamic properties
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays
会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:
Lu, Yao
;
Nie, Zhiqiang
;
Zhang, Pu
;
Wang, Zhenfu
;
Xiong, Lingling
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  |  
浏览/下载:39/0
  |  
提交时间:2016/11/22
Computer simulation
Electronics packaging
High power lasers
Numerical models
Occupational risks
Optical properties
Packaging
Power semiconductor diodes
Shear stress
Thermal stress
Double-cutting beam shaping technique for high-power diode laser area light source
期刊论文
optical engineering, 2013, 卷号: 52, 期号: 10
作者:
Huang, Zhihua
;
Xiong, Lingling
;
Liu, Hui
;
Wang, Zhenfu
;
Zhang, Pu
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  |  
浏览/下载:27/0
  |  
提交时间:2014/09/17
beam shaping
beam parameter product
laser diode
fiber coupling
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