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浏览/检索结果: 共5条，第1-5条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 A Numerical Model for Joule heating in Sn Solder Balls of Two Different Sizes 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Kunwar, Anil;  Shang, Shengyan;  Raback, Peter;  Song, Xueguan;  Malla, Prafulla Bahadur 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02 Miniaturization  Pb-free solder  FEM  Current density  Temperature   Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy 期刊论文 MICROELECTRONICS RELIABILITY, 2018, 卷号: 83, 页码: 198-205 作者:  Ma, Haoran;  Kunwar, Anil;  Chen, Jun;  Qu, Lin;  Wang, Yunpeng 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02 Electronic packaging  Zinc  Tin  Finite element method  SEM  Nemst-Planck equation   Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints 期刊论文 MICROELECTRONICS RELIABILITY, 2018, 卷号: 80, 页码: 55-67 作者:  Kunwar, Anil;  Shang, Shengyan;  Raback, Peter;  Wang, Yunpeng;  Givernaud, Julien 收藏  |  浏览/下载：18/0  |  提交时间：2019/12/02 Enthalpy  Finite element method  Intermetallic compound  Laser soldering  Diffusion  Scan speed   Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling 期刊论文 INTERMETALLICS, 2018, 卷号: 93, 页码: 186-196 作者:  Kunwar, Anil;  Guo, Bingfeng;  Shang, Shengyan;  Raback, Peter;  Wang, Yunpeng 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02 Intermetallics  Anisotropy  Joining  Microstructure  Finite-element modeling  Electron microscopy, scanning   A Computational Model for Simulation of Temperature during Radio-Frequency Ablation of Biological Tissue 会议论文 2018 IEEE International Conference on Computational Electromagnetics, ICCEM 2018, Chengdu, China, 2018-03-26 作者:  Kunwar, Anil;  Raback, Peter;  Shang, Shengyan;  Malla, Prafulla Bahadur;  Song, Xueguan 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02