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CORC

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An Efficient Approach to Remove Thick Cloud in VNIR Bands of Multi-Temporal Remote Sensing Images 期刊论文
REMOTE SENSING, 2019, 卷号: 11, 期号: 11
作者:  Du, Wenhui[1];  Qin, Zhihao[2];  Fan, Jinlong[3];  Gao, Maofang[4];  Wang, Fei[5]
收藏  |  浏览/下载：15/0  |  提交时间：2020/01/02
Synergistic Inhibitory Effect of Peptide-Organic Coassemblies on Amyloid Aggregation 期刊论文
ACS NANO, 2016, 卷号: 10, 期号: 4, 页码: 4143-4153
作者:  Niu, Lin[1];  Liu, Lei[2];  Xi, Wenhui[3];  Han, Qiusen[4];  Li, Qiang[5]
收藏  |  浏览/下载：12/0  |  提交时间：2019/12/24
Surface oxide analysis of lead-free solder particles 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2013, 卷号: 25, 页码: 39-44
作者:  Luo, Xin[1];  Du, Wenhui[2];  Lu, Xiuzhen[3];  Yamaguchi, Toshikazu[4];  Jackson, Gavin[5]
收藏  |  浏览/下载：7/0  |  提交时间：2019/04/30
An analysis on the power switching dynamic process in a new type of HEV 期刊论文
2011, 卷号: 33, 页码: 1018-1023
作者:  Du, Bo[1];  Qin, Datong[1];  Duan, Zhihui[2];  Yang, Wenhui[1];  Peng, Zhiyuan[1]
收藏  |  浏览/下载：6/0  |  提交时间：2019/11/29
Investigation of accelerated surface oxidation of Sn-3.5Ag-0.5Cu solder particles by TEM and STEM 会议论文
2011 International Symposium on Advanced Packaging Materials, APM 2011, 2011-10-25
作者:  Luo, Xin[1];  Du, Wenhui[2];  Lu, Xiuzhen[3];  Yamaguchi, Toshikazu[4];  Gavin, Jackson[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30
Influence of substrate on electrical conductivity of isotropic conductive adhesive 会议论文
2011 International Symposium on Advanced Packaging Materials, APM 2011, 2011-10-25
作者:  Hu, Zhili[1];  Du, Wenhui[2];  Yue, Cong[3];  Ye, Lilei[4];  Yuan, Zhichao[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30
Study on the Reliability of Fast Curing Isotropic Conductive Adhesive 会议论文
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13
作者:  Du, Wenhui[1];  Cui, Huiwang[2];  Chen, Si[3];  Yuan, Zhichao[4];  Ye, Lilei[5]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30
Study into High Temperature Reliability of Isotropic Conductive Adhesive 会议论文
2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011-08-08
作者:  Du, Wenhui[1];  Cui, Huiwang[2];  Chen, Si[3];  Yuan, Zhichao[4];  Ye, Lilei[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30
Optimization of stiffness for isotropic conductive adhesives 会议论文
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, 2010-02-28
作者:  Fu, Chune[1];  Chen, Si[2];  Berggren, P?r[3];  Fan, Qiong[4];  Du, Wenhui[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30
New Fast Curing Isotropic Conductive Adhesive for Electronic Packaging Application 会议论文
2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010-08-16
作者:  Du, Wenhui[1];  Fu, Chune[2];  Chen, Si[3];  Cui, Huiwang[4];  Liu, Xiaohua[5]
收藏  |  浏览/下载：9/0  |  提交时间：2019/04/30

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