CORC

浏览/检索结果: 共7条,第1-7条 帮助

已选(0)清除 条数/页:   排序方式:
Surface acoustic wave devices with graphene interdigitated transducers 期刊论文
Journal of Micromechanics and Microengineering, 2019, 卷号: Vol.29 No.1
作者:  Zhou, Jian;  Shi, Xianglong;  Xiao, Dingbang;  Wu, Xuezhong;  Zheng, Jiangpo
收藏  |  浏览/下载:13/0  |  提交时间:2019/12/13
Surface acoustic wave devices with graphene interdigitated transducers. 期刊论文
Journal of Micromechanics & Microengineering, 2019, 卷号: Vol.29 No.1, 页码: 1
作者:  Jian Zhou;  Xianglong Shi;  Dingbang Xiao;  Xuezhong Wu;  Jiangpo Zheng
收藏  |  浏览/下载:12/0  |  提交时间:2019/12/13
Surface acoustic wave devices with graphene interdigitated transducers 期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2019, 卷号: Vol.29 No.1
作者:  Zhou, Jian;  Shi, Xianglong;  Xiao, Dingbang;  Wu, Xuezhong;  Zheng, Jiangpo
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/13
Enhancing airtightness of TGV through regulating interface energy for wafer-level vacuum packaging 期刊论文
Microsystem Technologies, 2018, 卷号: Vol.24 No.9, 页码: 3645-3649
作者:  Yunbin Kuang;  Dingbang Xiao;  Jian Zhou;  Ming Zhuo;  Wenyin Li
收藏  |  浏览/下载:10/0  |  提交时间:2019/12/26
Surface acoustic wave devices with graphene interdigitated transducers 会议论文
Journal of Micromechanics and Microengineering, 015006, 2019
作者:  Jian Zhou;  Xianglong Shi;  Dingbang Xiao;  Xuezhong Wu;  Jiangpo Zheng
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/13
Theoretical model and experiments of glass reflow process in TGV for 3D wafer-level packaging 会议论文
2018 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), Moltrasio, Italy, 2018
作者:  Yunbin Kuang;  Dingbang Xiao;  Jian Zhou;  Wenyin Li;  Zhanqiang Hou
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/25
Theoretical analysis and experimental verification for 3D TGV packaging technology 会议论文
2018 IEEE Micro Electro Mechanical Systems (MEMS), Belfast, UK, 2018
作者:  Yunbin Kuang;  Dingbang Xiao;  Jian Zhou;  Wenyin Li;  Zhanqiang Hou
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/25


©版权所有 ©2017 CSpace - Powered by CSpace