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Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop 期刊论文
2018, 卷号: 82, 页码: 51-61
作者:  Gao, Bing[1];  Yang, Fan[1];  Chen, Minyou[1];  Chen, Yigao[2];  Lai, Wei[1]
收藏  |  浏览/下载:3/0  |  提交时间:2019/11/28
Study on the Effects of Small Swing of Junction Temperature Cycles on Solder Layer in an IGBT Module 会议论文
Hefei, PEOPLES R CHINA, MAY 22-26, 2016
作者:  Chen, Yigao[1];  Chen, Minyou[1];  Lai, Wei[1];  Ran, Li[1];  Xu, Shengyou[1]
收藏  |  浏览/下载:0/0  |  提交时间:2019/11/28
Study on the effects of small swing of junction temperature cycles on solder layer in an IGBT module 会议论文
Hefei, China, May 22, 2016 - May 26, 2016
作者:  Chen, Yigao[1];  Chen, Minyou[1];  Lai, Wei[1];  Ran, Li[1];  Xu, Shengyou[1]
收藏  |  浏览/下载:0/0  |  提交时间:2019/11/29


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