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科研机构
上海大学 [24]
重庆大学 [1]
内容类型
期刊论文 [22]
会议论文 [3]
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2018 [1]
2017 [1]
2016 [3]
2015 [2]
2014 [3]
2013 [3]
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Study on the influence of standoff distance on substrate damage under an abrasive water jet process by molecular dynamics simulation
期刊论文
FRICTION, 2018, 卷号: 6, 页码: 195-207
作者:
Chen, Ruling[1]
;
Zhang, Di[2]
;
Wu, Yihua[3]
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/04/24
standoff distance
crystalline silicon substrate
abrasive water jet
molecular dynamics simulation
CMP behavior of alumina/metatitanic acid core-shell abrasives on sapphire substrates
期刊论文
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2017, 卷号: 50, 页码: 263-268
作者:
Wang, Xin[1]
;
Lei, Hong[2]
;
Chen, Ruling[3]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/24
Chemical mechanical polishing (CMP)
alpha-Al2O3/TiO(OH)(2) core-shell abrasives
Sapphire
Mechanism
Isolation and Identification of a Cellulose-degrading Bac- terium from Paddy Soils in Chengdu City
期刊论文
2016, 卷号: 5, 页码: 42-43
作者:
Yulong CHEN[1,2]
;
Zhiyu SUN[2]
;
Jintao LI[3,4]
;
Ling SHEN[4]
;
Ruling HONG[3]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/11/30
Preparation of Mg-Doped Colloidal Silica Abrasives and Their Chemical Mechanical Polishing Performances on Sapphire
期刊论文
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2016, 卷号: 16, 页码: 9951-9957
作者:
Ma, Pan[1]
;
Lei, Hong[2]
;
Chen, Ruling[3]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/26
Chemical Mechanical Polishing (CMP)
Sapphire
Mg-Doped Colloidal Silica Abrasives
Material Removal Rate
Preparation of Ni-Doped Colloidal Silica Abrasives and Their Chemical Mechanical Polishing Performances on Sapphire
期刊论文
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2016, 卷号: 5, 页码: Q132-Q136
作者:
Ma, Pan[1]
;
Lei, Hong[2]
;
Chen, Yi[3]
;
Chen, Ruling[4]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/26
Preparation of cobalt-doped colloidal silica abrasives and their chemical mechanical polishing performances on sapphire
期刊论文
MICRO & NANO LETTERS, 2015, 卷号: 10, 页码: 657-661
作者:
Ma, Pan[1]
;
Lei, Hong[2]
;
Chen, Ruling[3]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/30
silicon compounds
cobalt
abrasives
time of flight mass spectra
secondary ion mass spectra
scanning electron microscopy
chemical mechanical polishing
surface roughness
atomic emission spectroscopy
X-ray photoelectron spectra
cobalt-doped colloidal silica abrasives
chemical mechanical polishing
seed-induced growth
time-of-flight secondary ion mass spectroscopy
scanning electron microscopy
CMP
sapphire substrates
surface roughness
material removal rate
inductively couple
Preparation of Fe-doped colloidal SiO2 abrasives and their chemical mechanical polishing behavior on sapphire substrates
期刊论文
APPLIED OPTICS, 2015, 卷号: 54, 页码: 7188-7194
作者:
Lei, Hong[1]
;
Gu, Qian[2]
;
Chen, Ruling[3]
;
Wang, Zhanyong[4]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/30
Preparation of porous alumina-g-polystyrene sulfonic acid abrasive and its chemical mechanical polishing behavior on hard disk substrate
期刊论文
MICROELECTRONIC ENGINEERING, 2014, 卷号: 116, 页码: 11-16
作者:
Huang, Liqin[1]
;
Wang, Zhijun[2]
;
Lei, Hong[3]
;
Chen, Ruling[4]
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2019/04/30
Chemical mechanical polishing (CMP)
Porous alumina-g-polystyrene sulfonic acid abrasive
Hard disk substrate
Planarization
Influence of Zn (II) ion on abrasive-free polishing of hard disk substrate
期刊论文
THIN SOLID FILMS, 2014, 卷号: 562, 页码: 377-382
作者:
Lei, Hong[1]
;
Zhao, Rong[2]
;
Chen, Ruling[3]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/30
Abrasive-free polishing
Hard disk substrate
Zinc (II) Ion
Material removal rate
Tribochemistry
Study of material removal processes of the crystal silicon substrate covered by an oxide film under a silica cluster impact: Molecular dynamics simulation
期刊论文
APPLIED SURFACE SCIENCE, 2014, 卷号: 305, 页码: 609-616
作者:
Chen, Ruling[1]
;
Wu, Yihua[2]
;
Lei, Hong[3]
;
Jiang, Ranran[4]
;
Liang, Min[5]
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2019/04/30
Material removal mechanism
Crystalline silicon substrate
Oxide film
Impact
Molecular dynamics simulation
Chemical mechanical polishing
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