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浏览/检索结果: 共6条，第1-6条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing 期刊论文 SOLDERING & SURFACE MOUNT TECHNOLOGY, 2014, 卷号: 26, 页码: 173-179 作者:  Ju, Guokui[1];  Lin, Fei[2];  Bi, Wenzhen[3];  Han, Yongjiu[4];  Wang Junjie[5] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/30 Intermetallic compounds  Microstructure  Thermal ageing  Filamentous Ag3Sn  Sn3.0Ag0.5Cu3.0Bi0.05Cr   Interfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu solder joints 期刊论文 SOLDERING & SURFACE MOUNT TECHNOLOGY, 2012, 卷号: 24, 页码: 249-256 作者:  Bi, Wenzhen[1];  Ju, Guokui[2];  Lin, Fei[3];  Xie, Shifang[4];  Wei, Xicheng[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30 Solders  Alloys  Tensile strength  Low-silver  IMC  Thermal aging  Thickness  Fracture mode  Lead-free  Packaging   Study on Sn-Ag-Cu-Bi-Er Solder with Low-Silver Content and Tensile Properties of the Solder Joints 期刊论文 RARE METAL MATERIALS AND ENGINEERING, 2012, 卷号: 41, 页码: 744-748 作者:  Bi Wenzhen[1];  Lin Fei[2];  Ju Guokui[3];  Xie Shifang[4];  Wei Xicheng[5] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/30 low-silver  SACBE  SAC  melting temperature  wettability   The comparative study on interfacial IMCs growth of three Cu/SnAgCu/Cu solder joints with Bi and Cr additions during thermal aging 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012-08-13 作者:  Ju, Guokui[1];  Bi, Wenzhen[2];  Lin, Fei[3];  Han, Yongjiu[4];  Wei, Xicheng[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30 Cu6Sn5  Ag3Sn  Aging  lead-free solder   Evolution of Ag3Sn at Sn-3.0Ag-0.3Cu-0.05Cr/Cu joint interfaces during thermal aging 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2011, 卷号: 509, 页码: 6666-6672 作者:  Lin, Fei[1];  Bi, Wenzhen[2];  Ju, Guokui[3];  Wang, Wurong[4];  Wei, Xicheng[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/30 Ag(3)Sn  Aging  Sn-3.0Ag-0.3Cu-0.05Cr/Cu joint  Intermetallic compounds (IMC)   Microstructure and mechanical properties of Sn3Ag0.5Cu3Bi0.05Cr/Cu joints 会议论文 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011-08-08 作者:  Lin, Fei[1];  Bi, Wenzhen[2];  Ju, Guokui[3];  Xie, Shifang[4];  Wei, Xicheng[5] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/30