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浏览/检索结果: 共3条，第1-3条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor 期刊论文 MICROMACHINES, 2018, 卷号: 9 作者:  Li, Haiwang;  Liu, Jiasi;  Xu, Tiantong;  Xia, Jingchao;  Tan, Xiao 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/30 through-silicon-vias (TSV)  high aspect ratio  control variable method  electroplating  three-dimensional (3D) inductor   Mechanical assembly of complex, 3D mesostructures from releasable multilayers of advanced materials 期刊论文 SCIENCE ADVANCES, 2016 Yan, Zheng; Zhang, Fan; Liu, Fei; Han, Mengdi; Ou, Dapeng; Liu, Yuhao; Lin, Qing; Guo, Xuelin; Fu, Haoran; Xie, Zhaoqian; Gao, Mingye; Huang, Yuming; Kim, JungHwan; Qiu, Yitao; Nan, Kewang; Kim, Jeonghyun; Gutruf, Philipp; Luo, Hongying; Zhao, An; Hwang, Keh-Chih; Huang, Yonggang; Zhang, Yihui; Rogers, John A. 收藏  |  浏览/下载：110/0  |  提交时间：2017/12/04 3D Assembly,buckling,microfabrication,multilayer,near field communication  NEAR-FIELD COMMUNICATION  STRETCHABLE ELECTRONICS  OPTICAL-DEVICES  MICROSTRUCTURES  ARCHITECTURES  FABRICATION  ORIGAMI  METAMATERIALS  CAPABILITIES  DEFORMATION   Simple and accurate inductance model of 3D inductor based on TSV 期刊论文 2016, 卷号: 52, 页码: 1815-1816 作者:  Wang, Fengjuan;  Yu, Ningmei 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/20 three-dimensional integrated circuits  inductors  solenoids  finite element analysis  integrated circuit modelling  on-chip inductors  integrated circuit application  through-silicon via  TSV  3D inductor  solenoid architecture  finite element method