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Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载:0/0  |  提交时间:2020/11/14
Simulation and Analysis of a Piezoelectric Balance 会议论文
作者:  Lv, Zhiguo;  Liu, Xi;  Zhang, Yahong;  Zhang, Xinong;  Luo, Yajun
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/02
Molecular properties of excited electronic state: Formalism, implementation, and applications of analytical second energy derivatives within the framework of the time-dependent density functional theory/molecular mechanics 期刊论文
http://dx.doi.org/10.1063/1.4863563, 2014
Zeng, Qiao; Liu, Jie; Liang, WanZhen; 刘婕; 梁万珍
收藏  |  浏览/下载:6/0  |  提交时间:2015/07/22
Lord and Shulman theory to a two-dimensional electromagneto-thermoelastic coupled problem 会议论文
作者:  He, TH;  Tian, XG;  Shen, YP
收藏  |  浏览/下载:8/0  |  提交时间:2019/11/15


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