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Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
San Francisco, CA, 2019-02-04
作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie
收藏  |  浏览/下载：53/0  |  提交时间：2019/06/28
Three-dimensions thermal model of a high-power diode laser bar 期刊论文
APPLIED OPTICS, 2018, 卷号: 57, 期号: 33, 页码: 9868-9876
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
收藏  |  浏览/下载：22/0  |  提交时间：2018/12/10
High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology 会议论文
San Francisco, CA, United states, 2018-01-30
作者:  Wang, Boxue;  Jia, Yangtao;  Zhang, Haoyu;  Jia, Shiyin;  Liu, Jindou
收藏  |  浏览/下载：71/0  |  提交时间：2018/04/25
Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文
components and packaging for laser systems iii 2017, san francisco, ca, united states, 2017-01-31
作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai
收藏  |  浏览/下载：77/0  |  提交时间：2017/06/08
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文
novel in-plane semiconductor lasers xvi 2017, san francisco, ca, united states, 2017-01-30
作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang
收藏  |  浏览/下载：24/0  |  提交时间：2017/07/06
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling
收藏  |  浏览/下载：40/0  |  提交时间：2016/11/22
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning
收藏  |  浏览/下载：15/0  |  提交时间：2016/10/18
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng
收藏  |  浏览/下载：11/0  |  提交时间：2016/10/18
Integrated heat-assisted magnetic recording head/laser assembly 专利
专利号: US9070387, 申请日期: 2015-06-30, 公开日期: 2015-06-30
作者:  DEMTCHOUK, ALEXANDER V.;  GONG, YONGPING
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/23
Packaging of Complete Indium-free High Reliable and High Power Diode Laser Array 会议论文
作者:  Wang, Jingwei;  Li, Xiaoning;  Feng, Feifei;  Liu, Yalong;  Hou, Dong
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/02

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