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CORC

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Erosion Process of Multiple Debris Flow Surges Caused by Check Dam Removal: An Experimental Study 期刊论文
WATER RESOURCES RESEARCH, 2022, 卷号: 58, 期号: 3, 页码: 16
作者:  Wang, Xi'an;  Chen, Jiangang;  Chen, Huayong;  Chen, Xiaoqing;  Li, Shuai
收藏  |  浏览/下载：14/0  |  提交时间：2022/10/09
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Study of Lifetime Prediction of Concrete in Western Region Based on Weibull Distribution 期刊论文
Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering, 2020, 卷号: 28, 期号: 4, 页码: 993-1005
作者:  Qiao, Hongxia;  Feng, Qiong;  Zhu, Binrong;  Z., Wei;  C., Lu
收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17
Study of Lifetime Prediction of Concrete in Western Region Based on Weibull Distribution 期刊论文
Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering, 2020, 卷号: 28, 期号: 4, 页码: 993-1005
作者:  Qiao, Hongxia;  Feng, Qiong;  Zhu, Binrong;  Wei, Zhiqiang;  Lu, Chenggong
收藏  |  浏览/下载：7/0  |  提交时间：2020/11/14
基于韦布尔分布和对数正态分布的高功率半导体激光器寿命估计和失效分析研究 期刊论文
红外与激光工程, 2019, 卷号: 48, 期号: S1
作者:  聂志强;  王明培;  孙玉博;  李小宁;  吴迪
收藏  |  浏览/下载：35/0  |  提交时间：2019/07/08
Material flow analysis on critical raw materials of lithium-ion batteries in China 期刊论文
JOURNAL OF CLEANER PRODUCTION, 2019, 卷号: 215, 页码: 570, 581
作者:  Song, JL;  Yan, WY;  Cao, HB;  Song, QB;  Ding, H
收藏  |  浏览/下载：44/0  |  提交时间：2019/06/14
Analysis of the reliability of LED lamps during accelerated thermal aging test by online method 期刊论文
Optik, 2019, 卷号: 178, 页码: 1045-1050
作者:  J.Hao;  H.L.Ke;  R.T.Sun;  Q.Sun;  L.Jing
收藏  |  浏览/下载：1/0  |  提交时间：2020/08/24
Prediction of lifetime by lumen degradation and color shift for LED lamps, in a non-accelerated reliability test over 20,000 h 期刊论文
Applied Optics, 2019, 卷号: 58, 期号: 7, 页码: 1855-1861
作者:  J.Hao;  H.L.Ke;  L.Jing;  Q.Sun;  R.T.Sun
收藏  |  浏览/下载：1/0  |  提交时间：2020/08/24
An optimized model for lifetime prediction of LED-based light bars using luminance degradation method 期刊论文
Lighting Research and Technology, 2018, 卷号: 50, 期号: 2, 页码: 316-325
作者:  Zhang, J.P.;  Bai, Y.F.;  Zhang, X.;  Chen, W.L.;  Li, W.B.
收藏  |  浏览/下载：16/0  |  提交时间：2020/11/14
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
A reliability assessment approach for systems with heterogeneous component information 期刊论文
QUALITY ENGINEERING, 2018, 卷号: 30, 期号: 4, 页码: 676-686
作者:  Xu, Jianyu;  Yu, Dan;  Hu, Qingpei;  Xie, Min
收藏  |  浏览/下载：15/0  |  提交时间：2019/04/02

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