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大连理工大学 [7]

兰州化学物理研究所 [2]

厦门大学 [1]

兰州理工大学 [1]

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	A comparative study of Ni75Fe25 microcomponents fabricated by microelectroforming and micromolding 期刊论文 ournal of Materials Processing Tech., 2021, 卷号: 290, 期号: 2021, 页码: 116997 作者: Zhou B(周波); Su B(苏博); Li M(李敏); Zhang AJ(张爱军); Han JS(韩杰胜) 收藏 \| 浏览/下载：7/0 \| 提交时间：2021/12/03 Microelectroforming Micromolding Ni75Fe25 Microcomponents
	Microelectroforming of freestanding metallic microcomponents using silver-coated poly(dimethylsiloxane) molds 期刊论文 Journal of Micromechanics and Microengineering, 2020, 卷号: 30, 期号: 4, 页码: 045013 作者: Bo Zhou; Bo Su; Min Li; Junhu Meng 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/30
	Fabrication of nickel micro gears by microelectroforming using PDMS molds 期刊论文 Zhongguo Kexue Jishu Kexue/Scientia Sinica Technologica, 2019, 卷号: 49, 期号: 2, 页码: 182-188 作者: Zhou, Bo; Wu, Youzhi; Su, Bo; Meng, Junhu; Han, Jiesheng 收藏 \| 浏览/下载：9/0 \| 提交时间：2022/02/17 Electroforming Fabrication Gold deposits Graphite Lithography Microchannels Micromachining Microstructure Molds Nickel Nickel metallography Polydimethylsiloxane Pulse width modulation Scanning electron microscopy Deposited layer Epitaxially grown Graphite substrate High quality Micro gear Microelectroforming Polydimethylsiloxane PDMS Soft lithography
	Influence of initial current density on bonding strength between Ni layer and Cu substrate in microelectroforming 期刊论文 JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2016, 卷号: 30, 页码: 2013-2023 作者: Shao, Ligeng; Wang, Liding; Du, Liqun 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/12/09 Oxygen content current density electrochemical activation bonding strength microelectroforming
	Quantitative relationship between crystallite size and adhesion strength of the electroforming layer during microelectroforming process 期刊论文 MICRO & NANO LETTERS, 2015, 卷号: 10, 页码: 64-66 作者: Zhao, Zhong; Du, Liqun 收藏 \| 浏览/下载：3/0 \| 提交时间：2019/12/09 crystallites adhesion fracture mechanics electroforming X-ray diffraction crystallite size electroforming layer microelectroforming process microelectromechanical systems micrometal devices interfacial adhesion strength fracture mechanics Miedema model experimental electron theory adhesion energy scratch testing X-ray diffraction technology
	Microstructure and mechanical properties of nanocrystalline nickel prepared by pulse reverse microelectroforming 期刊论文 JOURNAL OF EXPERIMENTAL NANOSCIENCE, 2014, 卷号: 9, 页码: 299-309 作者: Shao, Ligeng; Du, Liqun; Liu, Chong; Wang, Liding 收藏 \| 浏览/下载：6/0 \| 提交时间：2019/12/09 microelectroforming pulse reverse current (PRC) microhardness wear resistance
	Enhancing the Adhesion Strength Between Cu Substrate and Ni Layer in Microelectroforming 期刊论文 MATERIALS AND MANUFACTURING PROCESSES, 2014, 卷号: 29, 页码: 795-800 作者: Shao, Ligeng; Du, Liqun; Wang, Liding 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/12/09 Activation Adhesion Current Density Electrochemical Microelectroforming Strength
	Influence of electrodeposited crystallite size on interfacial adhesion strength of electroformed layers 期刊论文 MICRO & NANO LETTERS, 2014, 卷号: 9, 页码: 73-76 作者: Zhao, Zhong; Du, Liqun; Tan, Zhicheng 收藏 \| 浏览/下载：3/0 \| 提交时间：2019/12/09 adhesion crystallites current density electrodeposition electroforming internal stresses mechanical testing metallic thin films nickel X-ray diffraction electrodeposited crystallite size interfacial adhesion strength electroformed coating layers current density deposition compressive stress microelectroforming X-ray diffraction scratch testing Ni
	Electrochemical activation of substrate surfaces in microelectroforming 期刊论文 MICRO & NANO LETTERS, 2013, 卷号: 8, 页码: 872-876 作者: Shao, Ligeng; Du, Liqun; Wang, Liding 收藏 \| 浏览/下载：12/0 \| 提交时间：2019/12/11 adhesion copper current density electroforming micromechanical devices nickel surface treatment microfabrication electrochemical activation substrate surfaces microelectroforming manufacturing process metal microstructures microelectronic mechanical system current density cathodic overpotential chronopotentiometric method substrate activation adhesion strength Cu Ni
	Development of nanocrystalline nickel by pulse reverse microelectroforming 期刊论文 MICRO & NANO LETTERS, 2010, 卷号: 5, 页码: 165-170 作者: Shao, Ligeng; Du, Liqun; Wang, Liding 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/12/24

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