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浏览/检索结果: 共4条，第1-4条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Nanosecond-Laser-Based Charge Transfer Plasmon Engineering of Solution-Assembled Nanodimers 期刊论文 NANO LETTERS, 2018, 卷号: 18, 期号: 11, 页码: 7014-7020 作者:  Fang, Lingling;  Liu, Dilong;  Wang, Yueliang;  Li, Yanjuan;  Song, Lei 收藏  |  浏览/下载：57/0  |  提交时间：2019/12/25 Nanoparticles  Ag ion soldering  nanosecond laser  charge tranfser plasmon  self-assembly  DNA   Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions 期刊论文 ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, 2016, 卷号: 55, 期号: 46, 页码: 14294-14298 作者:  Fang, Lingling;  Wang, Yueliang;  Liu, Miao;  Gong, Ming;  Xu, An 收藏  |  浏览/下载：17/0  |  提交时间：2017/11/21 Dna Self-assembly  Nanodimers  Nanoparticles  Plasmonics  Sintering   The growth behavior of intermetallic compound layers of Sn-3Ag / Cu and Sn/Cu joints during soldering and aging 会议论文 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06, 2006-06-27 作者:  Cheng, C.-Q.;  Yang, P.;  Zhao, J.;  Zhu, F.;  Song, Q.-Y. 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/02 The growth behavior of inteimetallic compound layers of Sn-3Ag/Cu and Sn/Cu joints during soldering and aging 会议论文 8th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP 06), Shanghai Univ, Shanghai, PEOPLES R CHINA, 2006-01-01 作者:  Cheng, Cong-qian;  Yang, Peng;  Zhao, Jie;  Zhu, Feng;  Song, Qmg-Yang 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/27