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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 学科主题：Materials Science, Multidisciplinary     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 In-situ chemical interaction in cold-sprayed Zn/Cu composite coating 期刊论文 MATERIALS LETTERS, 2018, 卷号: 228, 页码: 246-249 作者:  Zhao, ZP;  Tang, JR;  Du, H;  Gyansah, L;  Wang, JQ 收藏  |  浏览/下载：36/0  |  提交时间：2018/12/25 Cold spraying  Zn/Cu composite coating  Interfaces  Intermetallic compounds  Amorphization   Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314 作者:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ 收藏  |  浏览/下载：29/0  |  提交时间：2018/12/25 Fe-Ni under bump metallization (UBM)  Intermetallic compounds (IMCs)  Electromigration (EM)  Diffusion  Vacancy formation   The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509 作者:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China. 收藏  |  浏览/下载：17/0  |  提交时间：2018/06/05 Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations   The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642 作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ 收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05 Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength   Hierarchical micro/nanoscale NdFe11Co oxide and alloy materials synthesized by polyol mediated methods with heat treatment 期刊论文 MATERIALS LETTERS, 2018, 卷号: 212, 页码: 202, 206 作者:  Nguyen Viet Long;  Yang, Yong;  Cao Minh Thi;  Le Hong Phuc;  Vu Phi Tuyen 收藏  |  浏览/下载：36/0  |  提交时间：2018/12/28 Crystal growth  Intermetallic alloys and compounds  NdFe11Co  Nd-Fe-B  Sm-Fe-B  Polyol mediated methods   Electromigration anisotropy introduced by tin orientation in solder joints 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271 Chen, Jian-Qiang; Liu, Kai-Lang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku 收藏  |  浏览/下载：22/0  |  提交时间：2017/08/17 Electromigration  Single crystal tin  Cu6Sn5  Intermetallic compounds  Orientation  Diffusion   Molecular Dynamics Simulation of Tensile Deformation and Fracture of gamma-TiAl with and without Surface Defects 期刊论文 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2016, 卷号: 32, 期号: 10, 页码: 1033-1042 Wu, HN; Xu, DS; Wang, H; Yang, R 收藏  |  浏览/下载：24/0  |  提交时间：2016/12/28 Intermetallic compounds  Superdislocation  Fracture  Surface defects  Molecular dynamics