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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 发表日期：2013    内容类型：会议论文    专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 An Empirical Study of the Relationship between FDI and Economic Growth in Zhejiang 会议论文 5th International Conference on Financial Risk and Corporate Finance Management, Dalian, PEOPLES R CHINA 作者:  Liu Feng;  Lu Yuduo;  Yu Jiao;  Zou Fei 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11 FDI  Economic growth  Co-integration  Granger causality test   Research on the Inner Relationship between Chinese Economic Growth and Energy Consumption 会议论文 5th International Conference on Financial Risk and Corporate Finance Management, Dalian, PEOPLES R CHINA 作者:  Zhang Qiluan;  Zeng Weiqiang 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11 Energy consumption  GDP growth  Granger causality test   Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging 会议论文 14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11 作者:  Liu, Xiaoying;  Huang, Mingliang;  Zhao, Ning;  Wang, Lai 收藏  |  浏览/下载：16/0  |  提交时间：2019/12/11 Composite lead-free solder  Intermetallic compound  Growth kinetics   Interfacial Reaction in Cu/Sn/Cu Fine Pitch Interconnect during Soldering 会议论文 14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11 作者:  Huang, Mingliang;  Liu, Ting;  Zhao, Ning;  Hao, Hua 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11 fine pitch interconnect  Cu/Sn/Cu  interfacial reaction  intermetallic compound  growth kinetics   The study of cooling process' effect on the growth of IMC at Sn-3.5Ag/Cu soldering interface 会议论文 14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11 作者:  Zhao, Huijing;  Qu, Lin;  Li, Hua;  Zhao, Ning;  Ma, Haitao 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/11 IMC  morphology  cooling  Cu6Sn5  secondary growth   Study on the Thermal Cracking Processes of Composite Subjected to Thermal Loading 会议论文 2nd International Conference on Civil Engineering and Transportation (ICCET 2012), Guilin, PEOPLES R CHINA, 2012-10-27 作者:  Tang Shibin;  Liang Zhengzhao;  Zhang Yafang 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/11 Thermal Mismatch Stress  Numerical Modeling  Crack Growth  Heterogeneity   The effect of cooling rate during the hydrothermal growth on the tip geometry of ZnO nanorods 会议论文 2nd International Conference on Materials and Products Manufacturing Technology (ICMPMT 2012), Guangzhou, PEOPLES R CHINA, 2012-09-22 作者:  Zhang, Heqiu;  Ren, Xiuming;  Hu, Lizhong;  Ji, Jiuyu;  Li, Yang 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11 ZnO  cooling rate  ultra-sharp  nanotip  hydrothermal growth   Study on the Sensitivity of R&D Funds Investment Fluctuations in the Eastern Part of China 会议论文 20th International Annual Conference on Management Science and Engineering, Harbin, PEOPLES R CHINA, 2013-07-17 作者:  Li Miao-miao;  Xiao Hong-jun 收藏  |  浏览/下载：15/0  |  提交时间：2019/12/11 eastern region  R&D funds investment fluctuations  beta-coefficient  R&D growth rate