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浏览/检索结果: 共12条，第1-10条 帮助 限定条件 专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 The influence of sintering process on thermal properties of nano-silver paste 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Lu, Xiuzhen[1];  Zhang, Qianran[2];  Zehri, Abdelhafid[3];  Ke, Wei[4];  Huang, Shirong[5] 收藏  |  浏览/下载：15/0  |  提交时间：2019/04/22 Thermal conductivity  Sintering temperature  sintering time  nano-silver paste  SiC particles   Highly accurate model for prediction of lung nodule malignancy with CT scans 期刊论文 Scientific reports, 2018, 卷号: 8, 页码: 9286 作者:  Causey Jason L[1];  Zhang Junyu[2];  Ma Shiqian[3];  Jiang Bo[4];  Qualls Jake A[5] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22 An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5] 收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24 Interconnect  CNTs based bumps  CNTs basednTSVs  resistivity  CNTs-Cu nanocomposite   Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5] 收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24 Graphene protection barrier  Cu-Plated PCB  Reliability   Effect of sintering method on properties of nanosilver paste 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Zhang, Qiaoran[1];  Liu, Jiawen[2];  Ke, Wei[3];  Huang, Shirong[4];  Latorre, Marti Gutierrez[5] 收藏  |  浏览/下载：16/0  |  提交时间：2019/04/24 nanosilver  sintering  thermal conductivity  shear strength   Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/24 heat dissipation  silver coated graphene  electrically conductive adhesive   PREVENTING AGING OF ELECTRICALLY CONDUCTIVE ADHESIVES ON METAL SUBSTRATE USING GRAPHENE BASED BARRIER 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者:  Ye, Hui[1];  Huang, Shirong[2];  Yuan, Zhichao[3];  Lu, Xiuzhen[4];  Jeppson, Kjell[5] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26 2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/26 Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging 期刊论文 JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2016, 卷号: 49 作者:  Bao, Jie[1];  Edwards, Michael[2];  Huang, Shirong[3];  Zhang, Yong[4];  Fu, Yifeng[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26 boron nitride  thermal conduction  lateral heat spreader  electrical insulation   SparRec: An effective matrix completion framework of missing data imputation for GWAS 期刊论文 Scientific reports, 2016, 卷号: 6, 页码: 35534 作者:  Jiang Bo[1];  Ma Shiqian[2];  Causey Jason[3];  Qiao Linbo[4];  Hardin Matthew Price[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/26