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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Synergistic effect between silver nanoparticles and antifungal agents on Candida albicans revealed by dynamic surface-enhanced Raman spectroscopy 期刊论文 Nanotoxicology, 2018, 卷号: 12, 页码: 1230-1240 作者:  Li Hao[1];  Wang Lihong[2];  Chai Yifeng[3];  Cao Yongbing[4];  Lu Feng[5] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/22 Antifungal activity  dynamic surface-enhanced Raman spectroscopy  silver nanoparticle  synergistic effect   Egg albumen templated graphene foams for high-performance supercapacitor electrodes and electrochemical sensors 期刊论文 JOURNAL OF MATERIALS CHEMISTRY A, 2018, 卷号: 6, 页码: 18267-18275 作者:  Liu, Ya[1];  Zhao, Xiaoli[2];  Wang, Cancan[3];  Zhang, Long[4];  Li, MengXiong[5] 收藏  |  浏览/下载：22/0  |  提交时间：2019/04/22 An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5] 收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24 Interconnect  CNTs based bumps  CNTs basednTSVs  resistivity  CNTs-Cu nanocomposite   Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5] 收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24 Graphene protection barrier  Cu-Plated PCB  Reliability   2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/26 Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging 期刊论文 JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2016, 卷号: 49 作者:  Bao, Jie[1];  Edwards, Michael[2];  Huang, Shirong[3];  Zhang, Yong[4];  Fu, Yifeng[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26 boron nitride  thermal conduction  lateral heat spreader  electrical insulation   Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing 期刊论文 ELECTRONIC MATERIALS LETTERS, 2016, 卷号: 12, 页码: 1-16 作者:  Bao, Jie[1];  Jeppson, Kjell[2];  Edwards, Michael[3];  Fu, Yifeng[4];  Ye, Lilei[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/26 two-dimensional hexagonal boron nitride  electronics manufacturing  van der waals heterostructures