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CORC

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Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
作者:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ
收藏  |  浏览/下载：29/0  |  提交时间：2018/12/25
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy 期刊论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 1333-1336
作者:  Wei, S;  Zhou, LJ;  Guo, JD
收藏  |  浏览/下载：25/0  |  提交时间：2018/12/25
Extreme anisotropy of electromigration: Nickel in single-crystal tin 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 卷号: 687, 页码: 999-1003
Wei, S; Ma, HC; Chen, JQ; Guo, JD
收藏  |  浏览/下载：72/0  |  提交时间：2016/12/28
The reliability of copper pillar under the coupling of thermal cycling and electric current stressing 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 卷号: 27, 期号: 9, 页码: 9748-9754
Ma, HC; Guo, JD; Chen, JQ; Wu, D; Liu, ZQ; Zhu, QS; Zhang, L; Guo, HY
收藏  |  浏览/下载：22/0  |  提交时间：2016/12/28
Electric-discharge compaction of nanocrystalline WC-10%Co powders 期刊论文
ACTA METALLURGICA SINICA, 2004, 卷号: 40, 期号: 9, 页码: 1000-1004
作者:  Wu, XY;  Zhang, W;  Wang, W;  Yang, F;  Min, JY
收藏  |  浏览/下载：0/0  |  提交时间：2021/02/02
Electropulsing-induced evolution of microstructures in materials 期刊论文
ACTA METALLURGICA SINICA, 2003, 卷号: 39, 期号: 10, 页码: 1009-1018
作者:  Zhang, W;  Sui, ML;  Zhou, YH;  He, GH;  Guo, JD
收藏  |  浏览/下载：0/0  |  提交时间：2021/02/02
The effect of electropulsing on dislocation structures in [(2)over-bar33] coplanar double-slip-oriented fatigued copper single crystals 期刊论文
PHILOSOPHICAL MAGAZINE LETTERS, 2002, 卷号: 82, 期号: 11, 页码: 617-622
作者:  Xiao, SH;  Guo, JD;  Li, SX
收藏  |  浏览/下载：11/0  |  提交时间：2021/02/02
Recrystallization of fatigued copper single crystals under electropulsing 期刊论文
ACTA METALLURGICA SINICA, 2002, 卷号: 38, 期号: 2, 页码: 161-165
作者:  Xiao, SH;  Guo, JD;  Wu, SD;  He, GH;  Li, SX
收藏  |  浏览/下载：8/0  |  提交时间：2021/02/02

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