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Creep behaviour of Sn-3.8Ag-0.7Cu under the effect of electromigration: Experiments and modelling 期刊论文
MICROELECTRONICS RELIABILITY, 2011, 卷号: 51, 页码: 1020-1024
作者:  Su, Fei;  Mao, Ronghai;  Wang, Xiaoyan;  Wang, Guangzhou;  Pan, Haiyan
收藏  |  浏览/下载:2/0  |  提交时间:2020/01/06


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