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CORC

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Accelerating polysulfide redox conversion on bifunctional electrocatalytic electrode for stable Li-S batteries 期刊论文
Energy Storage Materials, 2019, 卷号: 20, 页码: 98-107
作者:  Yu, Mingliang;  Zhou, Si;  Wang, Zhiyu;  Wang, Yuwei;  Zhang, Nan
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Ultrastable and high-capacity carbon nanofiber anodes derived from pitch/polyacrylonitrile for flexible sodium-ion batteries 期刊论文
CARBON, 2018, 卷号: 135, 页码: 187-194
作者:  Wang, Yuwei;  Xiao, Nan;  Wang, Zhiyu;  Tang, Yongchao;  Li, Hongqiang
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02
Two dimensional self-assembly zinc porphyrins and zinc phthalocyanines heterojunctions with record high power conversion efficiencies. 期刊论文
Journal of physics. Condensed matter : an Institute of Physics journal, 2018, 卷号: 30, 页码: 25LT02
作者:  Yu, Junting;  Jiang, Zhou;  Hao, Yifan;  Zhu, Qianhong;  Zhao, Mingliang
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Rational design of high-performance sodium-ion battery anode by molecular engineering of coal tar pitch 期刊论文
CHEMICAL ENGINEERING JOURNAL, 2018, 卷号: 342, 页码: 52-60
作者:  Wang, Yuwei;  Xiao, Nan;  Wang, Zhiyu;  Li, Hongjiang;  Yu, Mingliang
收藏  |  浏览/下载：17/0  |  提交时间：2019/12/02
A Polymetallic Metal-Organic Framework-Derived Strategy toward Synergistically Multidoped Metal Oxide Electrodes with Ultralong Cycle Life and High Volumetric Capacity 期刊论文
ADVANCED FUNCTIONAL MATERIALS, 2017, 卷号: 27
作者:  Niu, Shanshan;  Wang, Zhiyu;  Zhou, Tao;  Yu, Mingliang;  Yu, Mengzhou
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Stress relaxation and failure behavior of Sn-3.0Ag-0.5Cu flip-chip solder bumps undergoing electromigration 期刊论文
JOURNAL OF MATERIALS RESEARCH, 2014, 卷号: 29, 页码: 2556-2564
作者:  Huang, Mingliang;  Zhang, Zhijie;  Zhou, Shaoming;  Chen, Leida
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09
Effect of Liquid-solid Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu Solder Joint 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Huang, Mingliang;  Zhou, Qiang;  Ma, Haitao;  Zhao, Jie
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11
Dissolution of Substrates in Line-type Cu/Sn/Cu and Cu/Sn/Ni Interconnects under Current Stressing 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-08-13
作者:  Pan, Song;  Huang, Mingliang;  Zhao, Ning;  Zhou, Shaoming;  Zhang, Zhijie
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/13
Effects of Cooling Rate and Solder Volume on the Formation of Large Ag3Sn Plates in Sn-Ag Based Solder Joints 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Zhou, Qiang;  Huang, Mingliang;  Zhao, Ning;  Zhang, Zhijie
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/13
Effect of Solder Volume on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and the Substrates 会议论文
China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA, 2012-03-18
作者:  Yang, Fan;  Liu, Luwei;  Zhou, Qiang;  Liu, Ting;  Huang, Mingliang
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/18

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