CORC

在结果中检索

CORC

浏览/检索结果: 共9条，第1-9条 帮助

限定条件                
已选(0)清除 条数/页：   排序方式：
Mesenchymal stem cell-loaded porous tantalum integrated with biomimetic 3D collagen-based scaffold to repair large osteochondral defects in goats 期刊论文
STEM CELL RESEARCH & THERAPY, 2019, 卷号: 10, 页码: 72
作者:  Wei, Xiaowei;  Liu, Baoyi;  Liu, Ge;  Yang, Fan;  Cao, Fang
收藏  |  浏览/下载：49/0  |  提交时间：2019/12/02
Dense 3D Semantic SLAM of traffic environment based on stereo vision 会议论文
2018 IEEE Intelligent Vehicles Symposium, IV 2018, Changshu, Suzhou, China, 2018-09-26
作者:  Li, Linhui;  Liu, Zhijie;  Özgüner, Ümit;  Lian, Jing;  Zhou, Yafu
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02
A PCANet Based Method for Vehicle Make Recognition 会议论文
19th IEEE International Conference on Intelligent Transportation Systems (ITSC), Rio de Janeiro, BRAZIL, 2016-01-01
作者:  Li, Baojun;  Dong, Ying;  Zhao, Dedong;  Wen, Zhijie;  Yang, Lei
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09
Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electromigration 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Zhao, Jianfei;  Huang, Mingliang;  Zhao, Ning;  Zhang, Zhijie
收藏  |  浏览/下载：25/0  |  提交时间：2019/12/09
Migration behavior of indium atoms in Cu/Sn-52In/Cu interconnects during electromigration 期刊论文
JOURNAL OF MATERIALS RESEARCH, 2015, 卷号: 30, 页码: 3316-3323
作者:  Huang, Mingliang;  Zhang, Zhijie;  Zhao, Ning;  Yang, Fan
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09
Reverse Polarity Effect in Cu/Sn-9Zn/Ni Interconnect under High Current Density at High Temperature 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Huang, Mingliang;  Zhang, Zhijie;  Zhao, Ning;  Feng, Xiaofei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Study on Liquid-Solid Electromigration in Cu/Sn-9Zn/Cu Interconnect Using Synchrotron Radiation Real-Time in Situ Imaging Technology 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Huang, Mingliang;  Zhang, Zhijie;  Zhao, Ning;  Feng, Xiaofei
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/11
Dissolution of Substrates in Line-type Cu/Sn/Cu and Cu/Sn/Ni Interconnects under Current Stressing 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-08-13
作者:  Pan, Song;  Huang, Mingliang;  Zhao, Ning;  Zhou, Shaoming;  Zhang, Zhijie
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/13
Effects of Cooling Rate and Solder Volume on the Formation of Large Ag3Sn Plates in Sn-Ag Based Solder Joints 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Zhou, Qiang;  Huang, Mingliang;  Zhao, Ning;  Zhang, Zhijie
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/13

©版权所有 ©2017 CSpace - Powered by CSpace