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Image Denoising Based on Non-parametric ADMM Algorithm 会议论文
ADVANCES IN MULTIMEDIA INFORMATION PROCESSING - PCM 2018, PT II, 2018-01-01
作者:  Ye, Xinchen;  Zhang, Mingliang;  Yan, Qianyu;  Fan, Xin;  Luo, Zhongxuan
收藏  |  浏览/下载:11/0  |  提交时间:2019/12/02
Preparation of open tubular capillary columns by in situ ring-opening polymerization and their applications in cLC-MS/MS analysis of tryptic digest 期刊论文
ANALYTICA CHIMICA ACTA, 2017, 卷号: 979, 页码: 58-65
作者:  Wang, Hongwei;  Yao, Yating;  Li, Ya;  Ma, Shujuan;  Peng, Xiaojun
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/02
Caffeic acid phenethyl ester (CAPE) revisited: Covalent modulation of XPO1/CRM1 activities and implication for its mechanism of action 期刊论文
CHEMICAL BIOLOGY & DRUG DESIGN, 2017, 卷号: 89, 页码: 655-662
作者:  Wu, Sijin;  Zhang, Keren;  Qin, Hongqiang;  Niu, Mingshan;  Zhao, Weijie
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/02
Facile Synthesis of Dodecamine Organic Cage-Based Monolithic Microreactor via Ring-Opening Polymerization Following Spontaneous Reduction of Gold Ions for Continuous Flow Catalysis 期刊论文
CHEMISTRYSELECT, 2017, 卷号: 2, 页码: 10880-10884
作者:  Wang, Hongwei;  Ou, Junjie;  Chen, Lianfang;  Li, Ya;  Liu, Zhongshan
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/03
Effect of Electromigration on Interfacial Reaction of Cu/Sn3.0Ag0.5Cu/Ni Solder Joint at High Temperature 会议论文
12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Shanghai, PEOPLES R CHINA, 2011-08-08
作者:  Chen, Leida;  Huang, Mingliang;  Zhou, Shaoming;  Ye, Song;  Ye, Yuming
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/18
Electromigration-Induced Failure of Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joint 会议论文
12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Shanghai, PEOPLES R CHINA, 2011-08-08
作者:  Zhou, Shaoming;  Huang, Mingliang;  Chen, Leida;  Ye, Song;  Ye, Yuming
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/18
Failure mechanisms of Ni/Sn3.0Ag0.5Cu/OSP flip chip solder under high current stressing 会议论文
12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Shanghai, PEOPLES R CHINA, 2011-08-08
作者:  Ye, Song;  Huang, Mingliang;  Chen, Leida;  Zhou, Shaoming
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/18
Electromigration of 300 mu m Diameter Sn-3.0Ag-0.5Cu Lead-Free Bumps in Flip Chip Package 会议论文
11th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Xian, PEOPLES R CHINA, 2010-01-01
作者:  Ye, Song;  Huang, Mingliang;  Chen, Leida;  Liu, Xiaoying
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/24
Effect of Electromigration on the Cu-Ni Cross-interaction in Line-type Cu/Sn/Ni Interconnect 会议论文
11th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Xian, PEOPLES R CHINA, 2010-01-01
作者:  Chen, Leida;  Huang, Mingliang;  Zhou, Shaoming;  Ye, Song
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/24


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