CORC

在结果中检索

CORC

浏览/检索结果: 共22条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
"A Distributed Relation Detection Approach in the Internet of Things" (vol 2017, 4789814, 2017) 其他
2019-01-01
作者:  Zhu, Weiping;  Lu, Hongliang;  Cui, Xiaohui;  Cao, Jiannong
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/05
An efficient zigzag scanning and entropy coding architecture design 其他
2013-01-01
Cui, Tongbing; Zhu, Chuang; Cai, Yangang; Li, Meng; Jia, Huizhu; Xie, Don; Gao, Wen
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/17
窄带薄层色谱-红外光谱联用的研究 其他
2012-01-01
王方; 吴海军; 祝青; 魏永巨; 刘翠格; 布和巴特; 翟延君; 夏锦明; 徐怡庄; 吴瑾光; WANG Fang; WU Hai-jun; ZHU Qing; WEI Yong-yu; LIU Cui-ge; Buhebate; ZHAI Yan-jun; XIA Jin-ming; XU Yi-zhuang; WU Jin-guang
收藏  |  浏览/下载：2/0  |  提交时间：2015/10/24
Design and Process Development of a Stacked SRAM Memory Chip Module with TSV Interconnection 其他
2012-01-01
Ma, Shenglin; Sun, Xin; Zhu, Yunhui; Zhu, Zhiyuan; Cui, Qinghu; Chen, Meng; Xiao, Yongqiang; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16
Process Development and Characterization of BCB-based Redistribution Layer (RDL) for Silicon Interposer Application 其他
2012-01-01
Sun, Xin; Cui, Qinghu; Zhu, Yunhui; Ma, Shenglin; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16
A TSV Last Integration Approach with Wafer Level Pre-patterned Adhesive Bonding 其他
2012-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16
Understanding Effect of Additives in Copper Electroplating Filling for Through Silicon Via 其他
2012-01-01
Miao, Min; Zhu, Yunhui; Bian, Yuan; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Fang, Runiu; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16
Development of a Through-Stack-Via Integrated SRAM Module 其他
2012-01-01
Zhu, Yunhui; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Xiao, Yongqiang; Fang, Runiu; Liu, Zhenhua; Zhu, Zhiyuan; Gong, Xin; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/16
Process Development of a Stacked Chip Module with TSV Interconnection 其他
2012-01-01
Zhong, Xiao; Ma, Shenglin; Zhu, Yunhui; Bian, Yuan; Sun, Xin; Cui, Qinghu; Miao, Min; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16
Effect of Additives on Copper Electroplating Profile for TSV Filling 其他
2012-01-01
Zhu, Yunhui; Bian, Yuan; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16

©版权所有 ©2017 CSpace - Powered by CSpace