CORC

浏览/检索结果: 共33条,第1-10条 帮助

限定条件    
已选(0)清除 条数/页:   排序方式:
Microstructure and mechanical property of Ti3AlC2/TiAl3 composite synthesized by hot pressing (EI收录) 会议
Chengdu, China,
作者:  Chen, Wei Ping[1];  Zeng, Yong[1];  Li, Xiao Mei[1];  Xiao, Hua Qiang[2]
收藏  |  浏览/下载:8/0  |  提交时间:2019/04/11
Research on Nozzle Deposition and Printing Parameters for 3D Cell Printer System (CPCI-S收录) 会议
作者:  Mi, Sheng-Li[1];  Xu, Yuan-Yuan[1];  Liu, Duo-Jing[1];  Liu, Chang-Yong[1];  Wu, Zheng-Jie[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
Detection algorithm of semantic inconsistency for fuzzy ontology merging (EI收录) 会议
Guangzhou, China,
作者:  Luo, Yong Hong[1];  Liu, Wei Ming[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/12
Large magnetostrain in magnetic-field-aligned Mn0.965CoGe compound (CPCI-S收录) 会议
作者:  Hu, Qiu-Bo[1,2,3];  Hu, Yong[1,2];  Fang, Yong[4];  Wang, Dun-Hui[1,2];  Cao, Qing-Qi[1,2]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11
Nomogram Individually Predicts the Overall Survival of Patients with Gastroenteropancreatic Neuroendocrine Neoplasms (CPCI-S收录) 会议
作者:  Wei, W.[1];  Cheng, F.[1];  Jie, C.[2];  Zhiwei, Z.[1];  Ye, C.[3]
收藏  |  浏览/下载:6/0  |  提交时间:2019/04/11
MoS2 quantum dots interspersed WO3 nanoplatelet arrays with enhanced photoelectrochemical activity (CPCI-S收录) 会议
作者:  Xiao, Yong-Hao[1];  Zhang, Wei-De[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Enhancing distributed differential evolution with a space-driven topology (EI收录) 会议
Vancouver, BC, Canada,
作者:  Ge, Yong-Feng[1];  Yu, Wei-Jie[2];  Li, Jing-Jing[3];  Yu, Zhi-Wen[4];  Zhang, Jun[5]
收藏  |  浏览/下载:8/0  |  提交时间:2019/04/11
Development of the CPML for Four-Stages Split-Step Unconditionally-Stable FDTD Method (CPCI-S收录) 会议
作者:  Kong, Yong-Dan[1,2];  Xiao, Xing-Wei[1];  Chu, Qing-Xin[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
An artificial panel produced by sorting residue of copper clad laminate (CPCI-S收录) 会议
作者:  Chen, Yanzhi[1];  Wang, Wei[1];  Zhong, Mingfeng[2];  Wen, Yong[1];  Liu, Xiaowen[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Fabrication Process of a Triple-Layer Stacked TSV Interposer for Switch Matrix Consisting of Eight RF Chips (CPCI-S收录) 会议
作者:  Meng, Wei[1];  Guan, Yong[2];  Zeng, Qinghua[2];  Chen, Jing[2];  Jin, Yufeng[1,2]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11


©版权所有 ©2017 CSpace - Powered by CSpace