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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Familial Sudden Cardiac Death Caused by DSG2 Mutation as Genetic Backgrounds: Whole Exome Sequencing and Valid Therapy of Catheter Ablation (CPCI-S收录) 会议 作者:  Lin, Yubi[1,2,3,4,5,6,7];  Zhang, Qianhuan[1,2,3,4,5,6];  Chen, Jia[8];  Feng, Ruiling[1,2,3,4,5,6,7];  He, Siqi[1,2,3,4,5,6,7] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 SCN5A Mutants Associated with Familial Cardiac Sodium Overlap Syndrome Characterized as Sick Sinus Syndrome, Atrial Fibrillation, Brugada Syn (CPCI-S收录) 会议 作者:  Lin, Yubi[1,2];  Deng, Chunyu[1,2];  Zhan, XianZhang[1,2];  Xu, Zhe[3];  Zhu, Jiening[1,2] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/11 Fluctuation Similarity Modeling for Traffic Flow Time Series: A Clustering Approach (CPCI-S收录) 会议 作者:  Jiang, Shan[1];  Wang, Shuofeng[1];  Pei, Xin[1];  Li, Zhiheng[2];  Guo Weiwei[3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 traffic time series  fluctuation pattern  detrending  PCA  k-means   Creep deformation and fracture behavior of microscale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo- mechanical coupled loads (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Cao, Shan-Shan[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 micro-scale solder joint  creep deformation  current density  electro-thermo-mechanical coupled loads   Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-O.5Cu/Cu solder joints (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Cao, Shan-Shan[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 micro-scale solder joint  size effect  creep deformation  creep mechanism  fracture behavior