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The Thin Slice Data Generation in FDM Additive Manufacturing (CPCI-S收录) 会议
作者:  Zhou, Hong Fu[1];  Fan, Qin[2]
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/11
Application of patient-reported outcomes in clinical evaluation model of acupuncture for cervical spondylosis with SEM and ANNs (EI收录) 会议
Jeju Island, Korea, Republic of,
作者:  Guo, Li-Chun[1];  Zhang, Hong-Lai[1];  Wei, Hang[1, 2];  Wei, Xiao-Yan[1];  Lin, Qin-Ye[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
Couple-group consensus of multi-agent systems in the cooperation-competition network (EI收录) 会议
Chengdu, China,
作者:  Hu, Hong-Xiang[1];  Yu, Wenwu[1];  Wen, Guanghui[1];  Qin, Guozheng[2];  Cheng, Quanxin[1]
收藏  |  浏览/下载:6/0  |  提交时间:2019/04/11
Research on PRO scale of acupuncture for cervical spondylosis with multidimensional item response theory (EI收录) 会议
Jeju Island, Korea, Republic of,
作者:  Chen, Xiu-Juan[1, 2];  Zhang, Hong-Lai[1];  Lu, Feng[2];  Wei, Hang[1, 3];  Chen, Qin-Qun[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
An annealing stochastic ranking mechanism for constrained evolutionary optimization (EI收录) 会议
Hong Kong, China,
作者:  Ying, Wei-Qin[1];  Peng, Dong-Xin[1];  Xie, Yue-Hong[1];  Wu, Yu[2]
收藏  |  浏览/下载:6/0  |  提交时间:2019/04/11
An Annealing Stochastic Ranking Mechanism for Constrained Evolutionary Optimization (CPCI-S收录) 会议
作者:  Ying, Wei-qin[1];  Peng, Dong-xin[1];  Xie, Yue-hong[1];  Wu, Yu[2]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
Progress on the combined effects of PPCP residues in drinking water (EI收录) 会议
Guangzhou, China,
作者:  Gao, Huan-huan[1];  Qin, Li-tang[1];  Huang, Liang-liang[1];  Liang, Yan-peng[1];  Mo, Ling-Yun[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Current fundamental and applied research into clay minerals in China (CPCI-S收录) 会议
作者:  Zhou, Chun Hui[1,2];  Zhao, Li Zhi[1,2];  Wang, Al Qin[3];  Chen, Tian Hu[4];  He, Hong Ping[5]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
The interfacial thermo-mechanical reliability of 3D memory-chip stacking with through silicon via array (CPCI-S收录) 会议
作者:  Yuwen, Hui-Hui[1];  Qin, Hong-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Size and geometry effects on the electromigration behaviour of flip-chip Sn3.5Ag solder joints (CPCI-S收录) 会议
作者:  Qin, Hong-bo[1,2];  Yue, Wu[1,3];  Zhang, Xin-Ping[1];  Yang, Dao-guo[2]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11


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