CORC

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Research on thermal-electric coupling effect of the Copper Pillar Bump in the Flip Chip Packaging (CPCI-S收录) 会议
作者:  Fu Zhiwei[1,2];  Zhou Bin[1,2];  Yao Ruohe[1];  Li Xunping[2]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Research on thermal-electric coupling effect of the copper pillar bump in the flip chip packaging (EI收录) 会议
Wuhan, China,
作者:  Fu, Zhiwei[1,2];  Zhou, Bin[1,2];  Yao, Ruohe[1];  Li, Xunping[2]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
VDCOL Parameters Setting Influenced by Reactive Power Characteristics of HVDC System (CPCI-S收录) 会议
作者:  Li, Yao-Jia[1];  Wang, Juan-Juan[1];  Li, Zi-Lin[1];  Fu, Chuang[2]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/11
VDCOL parameters setting influenced by reactive power characteristics of HVDC system (EI收录) 会议
Chengdu, China,
作者:  Li, Yao-Jia[1];  Wang, Juan-Juan[1];  Li, Zi-Lin[1];  Fu, Chuang[2]
收藏  |  浏览/下载:6/0  |  提交时间:2019/04/11
The MicroRNAs and genes involved in asthma with the treatment of mesenchymal stem cells derived from human bone marrow (CPCI-S收录) 会议
作者:  Fu, Q-L[1];  Yao, Y.[1];  Tang, G-N[1];  Shi, J.[1];  Sun, Y-Q[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11


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