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Effect of autoclave cure cycles on the interfacial properties of composite laminates (EI收录) 会议
Munich, Germany,
作者:  Zhan, Lihua[1,2];  Tan, Wei[1,2,3];  Chang, Tengfei[1,4];  Ding, Xingxing[1,2]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interc (CPCI-S收录) 会议
作者:  Liang, Shui-Bao;  Ke, Chang-Bo;  Tan, Meng-Ying;  Zhou, Min-Bo;  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11


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