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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 内容类型：会议论文    专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 The influence of sintering process on thermal properties of nano-silver paste 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Lu, Xiuzhen[1];  Zhang, Qianran[2];  Zehri, Abdelhafid[3];  Ke, Wei[4];  Huang, Shirong[5] 收藏  |  浏览/下载：15/0  |  提交时间：2019/04/22 Thermal conductivity  Sintering temperature  sintering time  nano-silver paste  SiC particles   Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5] 收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24 Graphene protection barrier  Cu-Plated PCB  Reliability   Effect of sintering method on properties of nanosilver paste 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Zhang, Qiaoran[1];  Liu, Jiawen[2];  Ke, Wei[3];  Huang, Shirong[4];  Latorre, Marti Gutierrez[5] 收藏  |  浏览/下载：16/0  |  提交时间：2019/04/24 nanosilver  sintering  thermal conductivity  shear strength   Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/24 heat dissipation  silver coated graphene  electrically conductive adhesive   The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16 作者:  Huang, Shirong[1];  Bao, Jie[2];  Ye, Hui[3];  Wang, Ning[4];  Yuan, Guangjie[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/26 Graphene-based film  Thermal performance  Finite element analysis  Electronic packaging