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CORC

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The sixth visual object tracking VOT2018 challenge results 会议论文
15th European Conference on Computer Vision, ECCV 2018, Munich, Germany, 2018-09-08
作者:  Kristan, Matej;  Leonardis, Ale;  Matas, Jií;  Felsberg, Michael;  Pflugfelder, Roman
收藏  |  浏览/下载：140/0  |  提交时间：2019/12/02
Effect of particle size of carbon catalyst on oxygen reduction activity for fuel cell applications 会议论文
2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018), 2019-01-01
作者:  Suo, N.;  Ren, Y.;  Huang, H.;  Wu, A. M.;  Zhang, G. F.
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02
Electromigration-induced -Sn grain rotation in lead-free flip chip solder bumps 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Kuang, Jiameng M.;  Sun, Hongyu Y.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
A novel ant colony optimization based approach for flexible job-shop scheduling problem with operation and processing flexibility 会议论文
48th International Conference on Computers and Industrial Engineering, CIE 2018, Auckland, New zealand, 2018-12-02
作者:  Huang, Xuewen;  Huang, Mingxi;  Islam, Sardar M. N.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
The Visual Object Tracking VOT2017 challenge results 会议论文
2017 IEEE INTERNATIONAL CONFERENCE ON COMPUTER VISION WORKSHOPS (ICCVW 2017), 2017-01-01
作者:  Kristan, Matej;  Leonardis, Ales;  Matas, Jiri;  Felsberg, Michael;  Pflugfelder, Roman
收藏  |  浏览/下载：28/0  |  提交时间：2019/12/03
Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applications by imposing temperature gradient 会议论文
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017-01-01
作者:  Zhong, Y.;  Zhao, N.;  Ma, H. T.;  Dong, W.;  Huang, M. L.
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09
Novel growth of whole preferred orientation intermetallic compound interconnects for 3D IC packaging 会议论文
66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2016-05-31
作者:  Huang, M. L.;  Zhang, Z. J.;  Yang, F.;  Zhao, N.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Effect of Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni Interconnects 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Zhou, Q.;  Li, Q.;  Zhou, Y.;  Wang, X. J.;  Huang, M. L.
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/09
Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Fan, M.;  Huang, M. L.;  Zhao, N.
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09
The Visual Object Tracking VOT2016 Challenge Results 会议论文
14th European Conference on Computer Vision (ECCV), Amsterdam, NETHERLANDS
作者:  Kristan, Matej;  Leonardis, Ales;  Matas, Jiri;  Felsberg, Michael;  Pflugfelder, Roman
收藏  |  浏览/下载：24/0  |  提交时间：2019/12/09

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