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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 发表日期：2018     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Adiabatic shear localization in the CrMnFeCoNi high-entropy alloy 期刊论文 Acta Materialia, 2018, 卷号: 151, 页码: 424-431 作者:  Li, Zezhou;  Zhao, Shiteng;  Alotaibi, Senhat M.;  Liu, Yong;  Wang, Bingfeng 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/03 The CrMnFeCoNi HEA  Mechanical response  Adiabatic shear band   Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni substrates during the heat preservation stage 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 页码: 589-601 作者:  Guo, Bingfeng;  Kunwar, Anil;  Jiang, Chengrong;  Zhao, Ning;  Sun, Junhao 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02 Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling 期刊论文 INTERMETALLICS, 2018, 卷号: 93, 页码: 186-196 作者:  Kunwar, Anil;  Guo, Bingfeng;  Shang, Shengyan;  Raback, Peter;  Wang, Yunpeng 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02 Intermetallics  Anisotropy  Joining  Microstructure  Finite-element modeling  Electron microscopy, scanning   Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints 期刊论文 MATERIALS RESEARCH BULLETIN, 2018, 卷号: 99, 页码: 239-248 作者:  Guo, Bingfeng;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun;  Wang, Yunpeng 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02 Electronic materials  Intermetallic compounds  Microstructure  Electron microscopy  Diffusion