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金属研究所 [11]
上海应用物理研究所 [9]
湖南大学 [9]
新疆理化技术研究所 [3]
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期刊论文 [45]
会议论文 [1]
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2018 [46]
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Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect
期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3097-D3099
作者:
Zhu, QS
;
Zhang, X
;
Li, SJ
;
Liu, CZ
;
Li, CF
收藏
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浏览/下载:25/0
  |  
提交时间:2018/12/25
Highly Stable Transparent Conductive Electrodes Based on Silver-Platinum Alloy-Walled Hollow Nanowires for Optoelectronic Devices
期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2018, 卷号: 10, 期号: 42, 页码: 36128-36135
作者:
Zhou, KL
;
Han, CB
;
Li, CF
;
Jiu, JT
;
Yang, Y
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  |  
浏览/下载:37/0
  |  
提交时间:2018/12/25
Ag Nanowires
Ag@Pt alloy
transparent conductive electrodes
corrosion resistance
flexible optoelectronic devices
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
作者:
Gao, LY
;
Zhang, H
;
Li, CF
;
Guo, JD
;
Liu, ZQ
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  |  
浏览/下载:29/0
  |  
提交时间:2018/12/25
Fe-Ni under bump metallization (UBM)
Intermetallic compounds (IMCs)
Electromigration (EM)
Diffusion
Vacancy formation
Mechanical Strength and Structural Basis of beta(2) Integrin to Mediate Neutrophil Accumulation on Liver Sinusoidal Endothelial Cells: A Study Using Atomic Force Microscopy and Molecular Dynamics Simulations
期刊论文
CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES, 2018, 卷号: 116, 期号: 2, 页码: 263-279
作者:
Li N(李宁)
;
Zhang X(张潇)
;
Li PW
;
Yang H
;
Tong CF
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  |  
浏览/下载:57/0
  |  
提交时间:2018/10/30
Liver sinusoidal endothelial cells
neutrophils
beta(2) integrin
shear flow
mechanical strength
Integrating Extended Fourier Amplitude Sensitivity Test and Set Pair Analysis for Sustainable Development Evaluation from the View of Uncertainty Analysis
期刊论文
SUSTAINABILITY, 2018, 卷号: 10, 期号: 7, 页码: 2435
作者:
Lu, L (Lu, Ling)
;
Ma, CF (Ma, Chunfeng)
;
Luan, WF (Luan, Wenfei)
;
Li, X (Li, Xin)
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  |  
浏览/下载:22/0
  |  
提交时间:2019/05/29
HEIHE RIVER-BASIN
NORTHWEST CHINA
MODEL
SCIENCE
SYSTEM
COUNTRIES
FRAMEWORK
ENTROPY
OUTPUT
Development of low-alloyed and rare-earth-free magnesium alloys having ultra-high strength
期刊论文
ACTA MATERIALIA, 2018, 卷号: 149, 页码: 350-363
作者:
Pan, HC
;
Qin, GW
;
Huang, YM
;
Ren, YP
;
Sha, XC
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浏览/下载:180/0
  |  
提交时间:2018/06/05
Slow-speed Extrusion
Zn-zr Alloy
Ca-mn Alloy
Mechanical-properties
Low-temperature
Grain-refinement
Microstructure Evolution
Mg-3al-1zn Alloy
Prismatic-slip
Pure Magnesium
Development of low-alloyed and rare-earth-free magnesium alloys having ultra-high strength
期刊论文
ACTA MATERIALIA, 2018, 卷号: 149, 页码: 350-363
作者:
Pan HC
;
Qin GW
;
Huang YM
;
Ren YP
;
Sha XC
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  |  
浏览/下载:96/0
  |  
提交时间:2018/07/17
Mg Alloy
Mechanical Property
Dynamic Recrystallization
Segregation
Strengthening Mechanism
A unique hybrid-structured surface produced by rapid electrochemical anodization enhances bio-corrosion resistance and bone cell responses of beta-type Ti-24Nb-4Zr-8Sn alloy
期刊论文
SCIENTIFIC REPORTS, 2018, 卷号: 8, 页码: -
作者:
Liu, CF
;
Lee, TH
;
Liu, JF
;
Hou, WT
;
Li, SJ
收藏
  |  
浏览/下载:32/0
  |  
提交时间:2018/06/05
Elastic-deformation Behavior
Biomedical Titanium-alloys
Mechanical-properties
In-vitro
Osteoblast Differentiation
Nanoscale Topography
Protein Adsorption
Orthodontic Wires
Anodic-oxidation
Focal Adhesion
The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:
Tian, FF
;
Li, CF
;
Zhou, M
;
Liu, ZQ
;
Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
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浏览/下载:17/0
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提交时间:2018/06/05
Heterogeneous Binary-systems
Chemical-compound Layers
2 Elementary Substances
Eutectic Snin Solder
Intermetallic Compounds
Phase Identification
Reaction-diffusion
Growth-kinetics
Joint
Transformations
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:
Gao, LY
;
Li, CF
;
Wan, P
;
Zhang, H
;
Liu, ZQ
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  |  
浏览/下载:24/0
  |  
提交时间:2018/06/05
Lead-free Solders
Interfacial Reactions
Sn-ag
Intermetallic Compounds
Rich Solders
Joints
Growth
Reliability
Substrate
Strength
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