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科研机构
大连理工大学 [16]
内容类型
专利 [16]
发表日期
2015 [16]
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浏览/检索结果:
共16条,第1-10条
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发表日期:2015
内容类型:专利
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Three-dimensional packaging involves utilizing metal and brazing filler metal, providing brazing filler material with through hole, and then heating obtained product to carry out brazing reaction.
专利
申请日期: 2015-01-01, 公开日期: 2015-06-10
作者:
HUANG M ZHAO J ZHAO N ZHONG Y YAO M
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浏览/下载:2/0
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提交时间:2019/12/09
Oil paper capacitance transformer sleeve insulation state evaluation method, involves obtaining frequency domain spectral curve line capacitance value of oil paper sleeve, and establishing mathematics index function curve fitting function.
专利
申请日期: 2015-01-01, 公开日期: 2015-09-16
作者:
LI W SUN C WANG M ZHANG Q WU Y ZHAO
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浏览/下载:3/0
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提交时间:2019/12/09
Preparation of full metallic compound interconnecting welding point involves taking first substrate, plating, sputtering, annealing, sputtering, vapor depositing, evaporating, adding second substrate, plating, sputtering and welding.
专利
申请日期: 2015-01-01, 公开日期: 2015-06-10
作者:
HUANG M YANG F ZHANG Z ZHAO N HUANG F
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浏览/下载:2/0
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提交时间:2019/12/09
Carbon dioxide water hydrate layered sea water desalting device includes directly reactor main body part, sea water feeding precooling part, reactor temperature control part, carbon dioxide circulation control part and drainage part.
专利
申请日期: 2015-01-01, 公开日期: 2015-04-08
作者:
JIANG L LIU Y SONG Y YANG M ZHAO Y
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浏览/下载:9/0
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提交时间:2019/12/09
Mining potential adverse drug reaction data e.g. for categorizing drug, by collecting adverse drug reaction reports, processing, standardizing drug name, filtering known adverse reaction, calculating and sequencing association degrees.
专利
申请日期: 2015-01-01, 公开日期: 2015-07-08
作者:
LIN H ZHAO M
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浏览/下载:3/0
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提交时间:2019/12/09
Preparation method for flip chip full intermetallic compound interconnection welding point, involves providing upper part of second welding plate with welding layer, and providing inter-metallic compound between first plate and second plate.
专利
申请日期: 2015-01-01, 公开日期: 2015-06-17
作者:
HUANG M LIU Y MA H ZHAO N ZHONG Y H
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浏览/下载:2/0
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提交时间:2019/12/09
Intermetallic compound bonding method used for three-dimensional package chip stack, comprises putting solder and filler metal on both sides of metal bumps, heating, and brazing.
专利
申请日期: 2015-01-01, 公开日期: 2015-06-17
作者:
HUANG M MA H ZHAO J ZHAO N ZHONG Y
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浏览/下载:3/0
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提交时间:2019/12/09
Aquo-complex gas saturation change sediment pore distribution analysis method, involves obtaining fully absorbed-de-ionized water deposit by using applied external pressure, and maintaining temperature of inner rock core tube for period.
专利
申请日期: 2015-01-01, 公开日期: 2015-03-04
作者:
JIANG L LIU W SONG Y YANG M ZHAO Y
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浏览/下载:3/0
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提交时间:2019/12/09
Light-shielding plate mounted in vehicle, has processing unit which continuously analyzes face video image, and plate main portion which forms portion of shadow edge, when shadow edge is located at critical location below eye.
专利
申请日期: 2015-01-01, 公开日期: 2015-01-28
作者:
WANG S ZHANG M WANG Z ZHAO Y YAO B
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浏览/下载:9/0
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提交时间:2019/12/09
Impeller machine movable blade tip shroud structure, has force surface near front edge wing and pressure surface trailing edge wing connected near suction surface trailing edge wing.
专利
申请日期: 2015-01-01, 公开日期: 2015-07-08
作者:
LIU Y YANG J ZHANG M ZHANG T ZHAO G
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浏览/下载:6/0
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提交时间:2019/12/09
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