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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 发表日期：2014    专题：武汉理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Microstructure and mechanical properties of Al-7075/B4C composites fabricated by plasma activated sintering 期刊论文 Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 265-270 作者:  Shen, Qiang;  Wu, Chuandong;  Luo, Guoqiang*;  Fang, Pan;  Li, Chenzhang 收藏  |  浏览/下载：8/0  |  提交时间：2019/12/04 Plasma activated sintering  Al-7075/B4C composites  Microstructure  Bending strength  Compressive strength   A review of green roof research and development in China 期刊论文 Renewable and Sustainable Energy Reviews, 2014, 卷号: 40, 页码: 633-648 作者:  Xiao, Min;  Lin, Yaolin;  Han, Jie;  Zhang, Guoqiang* 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/04 Green roof  Research and development  China   Low-temperature densification and excellent thermal properties of W-Cu thermal-management composites prepared from copper-coated tungsten powders 期刊论文 Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 49-52 作者:  Zhang, Lianmeng（张联盟）;  Chen, Wenshu;  Luo, Guoqiang*;  Chen, Pingan;  Shen, Qiang 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/04 High thermal conductivity  Low coefficient of thermal expansion  Low-temperature densification  Microstructure  W-Cu composites   Effect of plasma activated sintering parameters on microstructure and mechanical properties of Al-7075/B4C composites 期刊论文 Journal of Alloys and Compounds, 2014, 卷号: 615, 页码: 276-282 作者:  Wu, Chuandong;  Fang, Pan;  Luo, Guoqiang;  Chen, Fei;  Shen, Qiang* 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/04 Plasma Activated Sintering  Al-7075/B4C Composites  Microstructure  Bending Strength  Compressive Strength   The Structure and Electrical Conductivity of the CNTs/PMMA Nanocomposites Foams 会议论文 8th China International Conference on High-Performance Ceramics (CICC-8), Chongqing, PEOPLES R CHINA, NOV 04-07, 2013 作者:  Shen, Qiang;  Yuan, Huan;  Xiong, Yuanlu;  Luo, Guoqiang*;  Zhang, Lianmeng 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/04 structure  electrical conductivity  CNTs  nanocomposites foams   Formation of intermetallic compounds in Mg-Ag-Al joints during diffusion bonding 期刊论文 Journal of Materials Science, 2014, 卷号: 49, 期号: 20, 页码: 7298-7308 作者:  Wang, Yiyu;  Luo, Guoqiang*;  Li, Leijun;  Shen, Qiang;  Zhang, Lianmeng（张联盟） 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/04 Microstructure and mechanical properties of TC4/oxygen-free copper joint with silver interlayer prepared by diffusion bonding 期刊论文 Materials Science and Engineering A, 2014, 卷号: 596, 页码: 45-51 作者:  Shen, Qiang;  Xiang, Huiying;  Luo, Guoqiang*;  Wang, Chuanbin;  Li, Meijuan 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/04 Diffusion bonding  Silver interlayer  Mechanical properties  Titanium alloys  Oxygen-free copper   Effect of 2,2′-dipyridyl on the plating rate, microstructure and performance of copper-coated tungsten composite powders prepared using electroless plating 期刊论文 Applied Surface Science, 2014, 卷号: 301, 页码: 85-90 作者:  Chen, Wenshu;  Luo, Guoqiang*;  Li, Meijuan;  Shen, Qiang;  Wang, Chuanbin 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/04 W-Cu  Electroless plating Cu  2,2 '-Dipyridyl  Plating Cu rate  Microstructure  Performance