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APPLICATIONS OF EDGE PRESERVATION RATIO IN IMAGE PROCESSING 会议论文
The 12th IEEE International Conference on Signal Processing (ICSP2014)
作者:  Shaode YU;  Wentao ZHANG;  Shibin WU;  Xiaolong LI;  Yaoqin XIE
收藏  |  浏览/下载：13/0  |  提交时间：2015/09/02
Automatic estimation of muscle thickness in ultrasound images based on revoting hough transform (RVHT) 会议论文
6th Chinese Conference on Pattern Recognition, CCPR 2014, Changsha, China
作者:  Jianhao Tan;  Xiaolong Li;  Wentao Zhang;  Yaoqin Xie;  Yongjin Zhou
收藏  |  浏览/下载：11/0  |  提交时间：2015/09/02
In-band pumping of Tm doped single mode tellurite composite fiber 会议论文
conference on optical components and materials xi
作者:  Li, Kefeng;  Fan, Xiaokang;  Zhang, Lei;  Yu, Chunlei;  Li, Wentao
收藏  |  浏览/下载：17/0  |  提交时间：2016/11/28
UV-LED system to obtain high power density in specific working-plane 会议论文
Beijing, China, October 9, 2014 - October 10, 2014
作者:  Li, Renyuan;  Sun, Xiuhui;  Gou, Jian;  Cai, Wentao;  Du, Chunlei
收藏  |  浏览/下载：18/0  |  提交时间：2018/03/16
A Method of Extracting Inter-Object Spatial Relationship in Remote Sensing Image Objects 会议论文
作者:  Zhu Guobin;  Li Jinggang;  Li Xue;  Yang Wentao;  Liu Xiaoli
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/05
THE COMPRESSION OF WIRELESS BASE STATION LTE-IR DATA USING ADAPTIVE FREQUENCY DOMAIN FLOATING-POINT CODING 会议论文
作者:  Chen, Jiayu;  Li, Wei
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/05
A spectral index for highlighting forest cover from remotely sensed imagery 会议论文
作者:  Ye, Wentao;  Zhang, Guo;  Chen, Xiaoling;  Li, Xi
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05
Mining Frequent Closed Sequential Patterns with Non-user-defined Gap Constraints 会议论文
作者:  Wang, Wentao;  Duan, Lei;  Nummenmaa, Jyrki;  Deng, Song;  Li, Zhongqi
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/05
A Life Prediction Approach Based on Integrated Failure Information 会议论文
2014 60TH ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM (RAMS), 2014-01-01
作者:  Li, Wentao;  Li, Xiaoyang;  Jiang, Tongmin
收藏  |  浏览/下载：3/0  |  提交时间：2020/01/06
Finite element analysis of thermoelectric refrigeration on the heat surface of the chip packaging 会议论文
3rd International Conference on Civil Engineering and Transportation (ICCET 2013), Kunming, PEOPLES R CHINA, DEC 14-15, 2013
作者:  Gao, Wentao*;  Luo, Qinghai;  Li, Gaofeng;  Xiao, Shenghao
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/27

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