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Electrodeposition of submicron/nanoscale Cu_2O/Cu junctions in an ultrathin CuSO_4 solution layer 期刊论文
Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry, 2010, 卷号: 638, 期号: 2, 页码: 225-230
作者:  Guangwei Yu;  Xiaobo Hu;  Duo Liu;  Daliang Sun;  Jing Li
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