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CORC

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Ultra-broadband Bragg concave diffraction grating designs on 220-nm SOI for wavelength demultiplexing 期刊论文
Optics Express, 2021, 卷号: 29, 期号: 19, 页码: 30259-30271
作者:  Li, Ke;  Zhu, Jingping;  Duan, Qihang;  Sun, Yuzhou;  Hou, Xun
收藏  |  浏览/下载：15/0  |  提交时间：2021/09/18
High-Precision Time-Frequency Signal Simultaneous Transfer System via a WDM-Based Fiber Link 期刊论文
PHOTONICS, 2021, 卷号: 8, 期号: 8
作者:  Zang, Qi;  Quan, Honglei;  Zhao, Kan;  Zhang, Xiang;  Deng, Xue
收藏  |  浏览/下载：40/0  |  提交时间：2021/09/09
Spectral–temporal hybrid modulation for channeled spectropolarimetry 期刊论文
Applied Optics, 2020, 卷号: 59, 期号: 30, 页码: 9359-9367
作者:  Li, Qiwei;  Alenin, Andrey S.;  Scott Tyo, J.
收藏  |  浏览/下载：16/0  |  提交时间：2020/11/10
Efficient Optical Angular Momentum Manipulation for Compact Multiplexing and Demultiplexing Using a Dielectric Metasurface 期刊论文
Advanced Optical Materials, 2020
作者:  Li, Siqi;  Li, Xingyi;  Zhang, Lei;  Wang, Guoxi;  Zhang, Lingxuan
收藏  |  浏览/下载：25/0  |  提交时间：2020/03/10
Thermal characteristics of kW-level conduction-cooled semiconductor laser array 期刊论文
Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering, 2017, 卷号: 46, 期号: 10
作者:  Zhu, Qiwen;  Zhang, Pu;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling
收藏  |  浏览/下载：59/0  |  提交时间：2017/12/30
Optimization of microchannel cooler of high power diode laser array package 会议论文
components and packaging for laser systems iii 2017, san francisco, ca, united states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei
收藏  |  浏览/下载：14/0  |  提交时间：2017/06/08
Application of ICCD to the readout system for 3D imaging calorimeter 期刊论文
核技术, 2017, 卷号: 40, 期号: 5, 页码: 29-36
作者:  Quan Zheng;  Wang Zhigang;  Wang Junjing;  Dong Yongwei;  Bai Yonglin
收藏  |  浏览/下载：33/0  |  提交时间：2017/09/04
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei
收藏  |  浏览/下载：30/0  |  提交时间：2016/11/22
Thermal modeling and analysis of high power semiconductor laser arrays 会议论文
2012 13th international conference on electronic packaging technology and high density packaging, icept-hdp 2012, guilin, china, august 13, 2012 - august 16, 2012
作者:  Pu Zhang;  Zhiqiang Nie
收藏  |  浏览/下载：8/0  |  提交时间：2013/06/26

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