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Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device 期刊论文
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2009, 卷号: 32, 期号: 3, 页码: 125-132
Cao, YH; Ning, WG; Luo, L
收藏  |  浏览/下载:17/0  |  提交时间:2012/03/24
Comparative study on MoO3 and HxMoO3 nanobelts: Structure and electric transport 期刊论文
CHEMISTRY OF MATERIALS, 2008, 卷号: 20, 期号: 4, 页码: 1527-1533
Hu, XK; Qian, YT; Song, ZT; Huang, JR; Cao, R; Xiao, JQ
收藏  |  浏览/下载:13/0  |  提交时间:2012/03/24


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