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Investigation of TaN as the wet etch stop layer for HKMG-last integration in the 22 nm and beyond nodes CMOS technology 期刊论文
Vacuum, 2015
作者:  Cui HS(崔虎山);  Luo J(罗军);  Xu J(许静);  Gao JF(高建峰);  Xiang JJ(项金娟)
收藏  |  浏览/下载:20/0  |  提交时间:2016/05/31
Integration Issue of Tensile SiN Liner for Dual Stress Liner(DSL) in Gate-Last High-k/Metal Gate(HKMG) Process Flow 期刊论文
ECS Trans., 2013
作者:  Wang GL(王桂磊);  Yin HZ(尹海洲);  Qin ZL(秦长亮)
收藏  |  浏览/下载:11/0  |  提交时间:2014/10/30
Impact of TaN as wet etch stop layer on device characteristics for dual metal HKMG last integration CMOSFETs 期刊论文
IEEE ELECTRON DEVICE LETTERS, 2013
作者:  Xu J(许静);  Tang ZY(唐兆云);  Yang H(杨红)
收藏  |  浏览/下载:7/0  |  提交时间:2014/10/30
Dummy Poly Silicon Gate Removal by Wet Chemical Etching 会议论文
作者:  Yang T(杨涛)
收藏  |  浏览/下载:14/0  |  提交时间:2012/11/19


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