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Fabrication of ultra-high aspect ratio silicon grating using an alignment method based on a scanning beam interference lithography system 期刊论文
Optics Express, 2022, 卷号: 30, 期号: 22, 页码: 40842-40853
作者:  X. S. Chen;  S. Jiang;  Y. B. Li;  Y. X. Jiang;  W. Wang and Bayanheshig
收藏  |  浏览/下载：0/0  |  提交时间：2023/06/14
The effects of TMDD-PA concentration on roughness of Si <1 1 0> and etching rate ratio of Si <1 1 0>/<1 1 1> in alkaline KOH solution 期刊论文
Chemical Physics, 2020, 卷号: 529, 页码: 4
作者:  C. L. Zhu,Q. B. Jiao,X. Tan,H. Hu and Bayanheshig
收藏  |  浏览/下载：6/0  |  提交时间：2021/07/06
Controllable fabrication of polygonal micro and nanostructures on sapphire surfaces by chemical etching after femtosecond laser irradiation 期刊论文
Optical Materials Express, 2019, 卷号: 9, 期号: 7, 页码: 2994-3005
作者:  H.B.Xie;  R.S.Joshya;  J.J.Yang;  C.L.Guo
收藏  |  浏览/下载：2/0  |  提交时间：2020/08/24
Insights Into the Influence of Sidewall Morphology on the Light Extraction Efficiency of Mini-LEDs 期刊论文
Ieee Photonics Journal, 2019, 卷号: 11, 期号: 4, 页码: 7
作者:  B.Tang;  J.H.Miao;  Y.C.Liu;  S.J.Zhou;  H.H.Xu
收藏  |  浏览/下载：1/0  |  提交时间：2020/08/24
Enhanced Light Extraction of Flip-Chip Mini-LEDs with Prism-Structured Sidewall 期刊论文
Nanomaterials, 2019, 卷号: 9, 期号: 3, 页码: 8
作者:  B.Tang;  J.Miao;  Y.C.Liu;  H.Wan;  N.Li
收藏  |  浏览/下载：1/0  |  提交时间：2020/08/24
High single-fundamental-mode power VCSEL integrated with alternating aluminum content micro-lens 期刊论文
Applied Optics, 2018, 卷号: 57, 期号: 24, 页码: 7055-7059
作者:  Huang, Y. W.;  Zhang, X.;  Zhang, J. W.;  Hofmann, W.;  Ning, Y. Q.
收藏  |  浏览/下载：1/0  |  提交时间：2019/09/17
Manufacturing and testing of the line-array fiber-optic image slicer based on silicon V-grooves (EI CONFERENCE) 会议论文
MEMS/MOEMS Technologies and Applications III, November 12, 2007 - November 14, 2007, Beijing, China
Liang J.; Guo P.; Liang Z.; Zhu Y.; Hou F.; Yao J.
收藏  |  浏览/下载：15/0  |  提交时间：2013/03/25
Linear fiber-optic image slicer is used more and more in spatial exploration and imaging system. In this paper  a plane arranging method of fiber-optic array based on Si-V grooves is established in order to improve the accuracy and reduce the cost of manufacturing. Firstly  the Si-V groove array is micro-machined with anisotropic etching process  then optical fibers are placed in the grooves orderly with plane arranging method. Secondly  the end surfaces of the device are polished  also the linear fiber-optic image slicer is packaged. Finally  some parameters are tested  including structure parameters  transmittivity and vibration test. Experimental results indicate that the maximum error accumulated in 2000 periods of the Si-V grooves is 0.5 m  the error of the height in Si-V grooves is less than 0.15m  the roughness of the end surface is less than 0.9nm. The transmittivity of the linear fiber-optic image slicer that without optical film is 51.46% at the wavelength of 632.8nm. After random vibration experiment  the ratio of the broken fiber increased by 0.1%. While the temperature reached 320C  the stress of epoxy will be 130Mpa  which is close to the limit resistance stress of 139Mpa  some cracks appeared.  
Study on the fabrication of orange micro-LED arrays for display (EI CONFERENCE) 会议论文
ICO20: Display Devices and Systems, August 21, 2005 - August 26, 2005, Changchun, China
Jin X.; Liang J.; Li J.; Zhao L.; Wang W.
收藏  |  浏览/下载：22/0  |  提交时间：2013/03/25
Arrays of micro-sized LEDs which can be used as microdisplays have been demonstrated in recent years. In order to reduce the input and output connections to the arrays  we employ a matrix addressable architecture  in which all the pixels in each row are connected by a common metal line on the top of the window layer (top electrode) or at the base of substrate(bottom electrode). Decreasing the size of electrodes makes for minimizing the size of device. The optic and electric isolation and good ohmic contact are also helpful to obtain superior optical and electrical performance. We describe a procedure of fabrication of AlGalnP-based orange micro-LED by wet etching. The structure of devices is etched using both isotropic and anisotropic etchant. The pixel size is about 16um 20um  and there are 1000 818 pixels in the light emitting chip whose diagonal is 1-in.  
Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE) 会议论文
MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China
Ming A.; Liang J.; Lan W.; Dong W.; Yao J.; Wang W.; Le Z.; Chen W.; Wang L.
收藏  |  浏览/下载：22/0  |  提交时间：2013/03/25
We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges  Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment  thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in  sixteen V-grooves for optical fibers  and micropits for micro ball lenses  all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners  where different geometries meet. Through this assembling method  the fiber  micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.  

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