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科研机构
金属研究所 [73]
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期刊论文 [68]
学位论文 [5]
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2021 [3]
2020 [2]
2019 [4]
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Materials ... [4]
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A perspective on effect by Ag addition to corrosion evolution of Pb-free Sn solder
期刊论文
MATERIALS LETTERS, 2021, 卷号: 297, 页码: 4
作者:
Qiao, Chuang
;
Sun, Xu
;
Wang, Youzhi
;
Hao, Long
;
An, Xizhong
收藏
  |  
浏览/下载:57/0
  |  
提交时间:2021/10/15
Lead-free solder
Thin films
Oxidation
Corrosion
X-ray photoelectron spectroscopy (XPS)
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:
Chen, Yinbo
;
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2021/03/15
Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
作者:
Liu, C. Z.
;
Wang, J. J.
;
Zhu, M. W.
;
Liu, X. M.
;
Lu, T. N.
收藏
  |  
浏览/下载:25/0
  |  
提交时间:2021/02/03
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder
期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2021/02/02
Sn nanowire
Template electrodeposition
Microstructural characterization
Liquid bath melting
Lead-free solder
Melting point
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder
期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2021/02/02
Sn nanowire
Template electrodeposition
Microstructural characterization
Liquid bath melting
Lead-free solder
Melting point
Reliability issues of lead-free solder joints in electronic devices
期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
作者:
Jiang, Nan
;
Zhang, Liang
;
Liu, Zhi-Quan
;
Sun, Lei
;
Long, Wei-Min
收藏
  |  
浏览/下载:77/0
  |  
提交时间:2021/02/02
Lead-free solder
reliability
IMC
crack
failure
Structure and properties of Sn-Cu lead-free solders in electronics packaging
期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:
Zhao, Meng
;
Zhang, Liang
;
Liu, Zhi-Quan
;
Xiong, Ming-Yue
;
Sun, Lei
收藏
  |  
浏览/下载:130/0
  |  
提交时间:2021/02/02
Sn-Cu
microstructures
IMC
mechanical properties
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:
Zhao, Meng
;
Zhang, Liang
;
Liu, Zhi-quan
;
Xiong, Ming-yue
;
Sun, Lei
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:
Zhao, Meng
;
Zhang, Liang
;
Liu, Zhi-quan
;
Xiong, Ming-yue
;
Sun, Lei
收藏
  |  
浏览/下载:23/0
  |  
提交时间:2021/02/02
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:
Shi, QY
;
Liu, ZQ
;
Wu, D
;
Zhang, H
;
Ni, DR
收藏
  |  
浏览/下载:30/0
  |  
提交时间:2018/06/05
Al/diamond Composites
Thermal-conductivity
Coated Diamond
Heat Sinks
Densification
Microstructure
Mechanisms
Strength
Surface
Growth
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