CORC

在结果中检索

CORC

浏览/检索结果: 共30条，第1-10条 帮助

限定条件                
已选(0)清除 条数/页：   排序方式：
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：12/0  |  提交时间：2021/03/15
Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.
收藏  |  浏览/下载：25/0  |  提交时间：2021/02/03
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
收藏  |  浏览/下载：130/0  |  提交时间：2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei
收藏  |  浏览/下载：19/0  |  提交时间：2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei
收藏  |  浏览/下载：23/0  |  提交时间：2021/02/02
Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 5, 页码: 2297-2304
X. J. Wang; Q. S. Zhu; B. Liu; N. Liu; F. J. Wang
收藏  |  浏览/下载：17/0  |  提交时间：2014/07/03
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933
H. Zhang; Q. S. Zhu; Z. Q. Liu; L. Zhang; H. Y. Guo; C. M. Lai
收藏  |  浏览/下载：24/0  |  提交时间：2015/01/14
Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文
Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558
L. M. Yang; Z. F. Zhang
收藏  |  浏览/下载：11/0  |  提交时间：2013/12/24
The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy 期刊论文
Journal of Alloys and Compounds, 2013, 卷号: 550, 页码: 231-238
C. F. Li; Z. Q. Liu; J. K. Shang
收藏  |  浏览/下载：18/0  |  提交时间：2013/12/24
Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177
H. F. Zou; Q. K. Zhang; Z. F. Zhang
收藏  |  浏览/下载：16/0  |  提交时间：2013/02/05

©版权所有 ©2017 CSpace - Powered by CSpace