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CORC

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Tensile creep behavior of Sn-Ag-Cu-Ni multicomponent lead-free solder alloy 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 卷号: 27, 页码: 6630-6636
作者:  Zhao, N.;  Huang, M. L.;  Wu, C. M. L.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09
Tin-zinc-bismuth lead-free solder alloy for soldering aluminum-copper comprises zinc, bismuth, aluminum, nickel, and/or tin. 专利
申请日期: 2014-01-01, 公开日期: 2014-04-23
作者:  HUANG M ZHANG F ZHAO N ZHANG T YANG Y
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11
Tin zinc nickel lead-free solder alloy for aluminum and copper soldering, has zinc, and nickel in specified amounts. 专利
申请日期: 2014-01-01, 公开日期: 2014-04-09
作者:  HUANG M ZHAO J ZHAO N MA H DONG C H
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11
Tin-zinc-based near eutectic lead-free solder alloy for aluminum soft soldering, comprises specified amount of zinc, aluminum and tin. 专利
申请日期: 2012-01-01, 公开日期: 2012-12-12
作者:  KANG N ZHOU Q HUANG M DONG C ZHAO N
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/18
Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders 期刊论文
50th Electronic Materials Conference, 2009, 卷号: 38, 页码: 828-833
作者:  Zhao, N.;  Pan, X. M.;  Yu, D. Q.;  Ma, H. T.;  Wang, L.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24
Properties of lead-free solder alloys with rare earth element additions 期刊论文
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2004, 卷号: 44, 页码: 1-44
作者:  Wu, CML;  Yu, DQ;  Law, CMT;  Wang, L
收藏  |  浏览/下载：6/0  |  提交时间：2020/01/02
Effects of Bi, Ni additives on the microstructures and wetting properties of Sn-Zn-Cu lead-free alloy 会议论文
International Conference on Asian Green Electronics - Design for Manufacturability and Reliability (2005 AGEC), Shanghai, PEOPLES R CHINA
作者:  Xie, HP;  Yu, DQ;  Wang, L
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/02
Creep Behavior of eutectic Sn-Cu lead-free solder alloy (vol 31, pg 442, 2002) 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2002, 卷号: 31, 页码: 828-828
作者:  Wu, CML;  Huang, ML
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/02
Creep behavior of eutectic Sn-Ag lead-free solder alloy 期刊论文
JOURNAL OF MATERIALS RESEARCH, 2002, 卷号: 17, 页码: 2897-2903
作者:  Huang, ML;  Wang, L;  Wu, CML
收藏  |  浏览/下载：1/0  |  提交时间：2020/01/02
Creep behavior of eutectic Sn-Cu lead-free solder alloy 期刊论文
43rd Electronic Materials Conference, 2002, 卷号: 31, 页码: 442-448
作者:  Wu, CML;  Huang, ML
收藏  |  浏览/下载：3/0  |  提交时间：2020/01/02

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