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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetallic Compounds in Sn-0.7Cu/Cu Joint 会议论文 16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11 作者:  Guo, Bingfeng;  Kunwar, Anil;  Ma, Haoran;  Liu, Jiahui;  Li, Shuang 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09 IMC  morphology  cooling  temperature  synchrotron radiation   The microstructures investigation in laser weld bonding AZ31B Mg to 6061Al joint 期刊论文 China welding, 2013, 卷号: 22, 页码: 21-26 作者:  Wang H.;  Ren D.;  Liu L. 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/13 A numerical study on heat transfer performance of microchannels with different surface microstructures 期刊论文 APPLIED THERMAL ENGINEERING, 2011, 卷号: 31, 页码: 921-931 作者:  Liu, Y.;  Cui, J.;  Jiang, Y. X.;  Li, W. Z. 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/18 Microchannel  Heat transfer  Numerical simulation  CFD  LBM   Polarimetric heterodyning fiber grating laser sensors 会议论文 Conference on Photonic Microdevices/Microstructures for Sensing III, Orlando, FL, 2011-04-27 作者:  Guan, Bai-Ou;  Zhang, Yang;  Tan, Yan-Nan;  Guo, Tuan;  Tam, Hwa-Yaw 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/18 Fiber Bragg grating  fiber grating laser  fiber optic sensor  polarimetric sensor  sensor multiplexing   Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetallic Compounds in Sn-Ag/Cu Joint 会议论文 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Shanghai, PEOPLES R CHINA, 2011-08-08 作者:  Gu, Liyu;  Qu, Lin;  Ma, Haitao;  Luo, Zhongbing;  Wang, Lai 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/18 Effect if soldering Temperature and Cooling Rate on the As-soldered Microstructures of Intermetallic Compounds in Sn-Ag/Cu Joint 会议论文 2011 International Conference on Electronic Packaging Technology & High Density Packaging 作者:  Ma HT(马海涛) 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/18